NXP Semiconductors MC9S12XEP100CAL Microcontroller, Microprocessor, FPGA Modules
IC MCU 16BIT 1MB FLASH 112LQFP
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
MC9S12XEP100CAL
Detailed Description
IC MCU 16BIT 1MB FLASH 112LQFP
Package
112-LQFP
Key Features
Package / Case: 112-LQFP; Mounting Type: Surface Mount
Lifecycle Status
Active
RoHS State
RoHS Compliant
Datasheet
MC9S12XEP100CAL Datasheet
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Technical Specifications
NXP Semiconductors MC9S12XEP100CAL Microcontroller, Microprocessor, FPGA Modules technical specifications.
General
RAM Size
64K x 8
Package / Case
112-LQFP
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 85°C (TA)
Supply Voltage
1.72V ~ 5.5V
Peripherals
LVD, POR, PWM, WDT
Number of I/O
91
Speed
50MHz
EEPROM Size
4K x 8
Core Processor
HCS12X
Alternate Parts Comparison (MC9S12XEP100CAL vs S912XEG128BCAL vs S912XEP100J4MAL vs MC9S12B128CPVE)
Side-by-side technical parameter comparison of related primary models in this product family.
| This Part | Alternate Parts | Alternate Parts | Alternate Parts | |
|---|---|---|---|---|
| Package / Case | 112-LQFP | 112-LQFP | 112-LQFP | 112-LQFP |
| Mounting Type | Surface Mount | Surface Mount | Surface Mount | Surface Mount |
| Operating Temperature | -40°C ~ 85°C (TA) | -40°C ~ 85°C (TA) | -40°C ~ 125°C (TA) | -40°C ~ 85°C (TA) |
| Supply Voltage | 1.72V ~ 5.5V | 1.72V ~ 5.5V | 1.72V ~ 5.5V | 2.35V ~ 5.5V |
| Core Processor | HCS12X | HCS12X | HCS12X | HCS12 |
| Core Size | 16-Bit | 16-Bit | 16-Bit | 16-Bit |
| RAM Size | 64K x 8 | 12K x 8 | 64K x 8 | 4K x 8 |
| Connectivity | CANbus, EBI/EMI, I²C, IrDA, SCI, SPI | CANbus, EBI/EMI, I²C, IrDA, SCI, SPI | CANbus, EBI/EMI, I²C, IrDA, SCI, SPI | CANbus, I²C, SCI, SPI |
| Data Converters | A/D 16x12b | A/D 16x12b | A/D 16x12b | A/D 16x10b |
| EEPROM Size | 4K x 8 | 2K x 8 | 4K x 8 | 1K x 8 |
| Number of I/O | 91 | 91 | 91 | 91 |
| Oscillator Type | External | External | External | Internal |
| Action |
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