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NXP Semiconductors S9S08RN8W2MTGR Microcontroller, Microprocessor, FPGA Modules

IC MCU 8BIT 8KB FLASH 16TSSOP

40,645 ActiveNXP Semiconductors16-TSSOP (0.173", 4.40mm Width)RoHS
S9S08RN8W2MTGR - No Image Available

Same model may have multiple batches, images only for reference.

S9S08RN8W2MTGR
Manufacturer
Part Number (MPN)
S9S08RN8W2MTGR
Detailed Description
IC MCU 8BIT 8KB FLASH 16TSSOP
Package
16-TSSOP (0.173", 4.40mm Width)
Key Features
Package / Case: 16-TSSOP (0.173", 4.40mm Width); Mounting Type: Surface Mount
Lifecycle Status
Active
RoHS State
RoHS Compliant
Datasheet
PDF S9S08RN8W2MTGR Datasheet
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Technical Specifications

NXP Semiconductors S9S08RN8W2MTGR Microcontroller, Microprocessor, FPGA Modules technical specifications.

General

RAM Size
2K x 8
Package / Case
16-TSSOP
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 125°C (TA)
Supply Voltage
2.7V ~ 5.5V
Peripherals
LVD, POR, PWM, WDT
Number of I/O
12
Speed
20MHz
EEPROM Size
256 x 8
Core Processor
S08

Alternate Parts Comparison (S9S08RN8W2MTGR vs PCA9557PW,118 vs MC68HC908QY2CDT vs MC9S08SE8CTG)

Side-by-side technical parameter comparison of related primary models in this product family.

This PartAlternate PartsAlternate PartsAlternate Parts
Package / Case16-TSSOP16-TSSOP16-TSSOP16-TSSOP
Mounting TypeSurface MountSurface MountSurface MountSurface Mount
Operating Temperature-40°C ~ 125°C (TA)-40°C ~ 85°C-40°C ~ 85°C (TA)-40°C ~ 85°C (TA)
Supply Voltage2.7V ~ 5.5V2.3V ~ 5.5V2.7V ~ 5.5V2.7V ~ 5.5V
Number of I/O1281314
Core ProcessorS08--HC08S08
Core Size8-Bit--8-Bit8-Bit
RAM Size2K x 8--128 x 8512 x 8
Data ConvertersA/D 8x10b--A/D 4x8bA/D 10x10b
Oscillator TypeInternal--InternalInternal
PeripheralsLVD, POR, PWM, WDT--LVD, POR, PWMLVD, POR, PWM
Program Memory Size8KB (8K x 8)--1.5KB (1.5K x 8)8KB (8K x 8)
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