NXP Semiconductors MC9S08PA16AVTGR Microcontroller, Microprocessor, FPGA Modules
IC MCU 8BIT 16KB FLASH 16TSSOP
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
MC9S08PA16AVTGR
Detailed Description
IC MCU 8BIT 16KB FLASH 16TSSOP
Package
16-TSSOP (0.173", 4.40mm Width)
Key Features
Package / Case: 16-TSSOP (0.173", 4.40mm Width); Mounting Type: Surface Mount
Lifecycle Status
Active
RoHS State
RoHS Compliant
Datasheet
MC9S08PA16AVTGR Datasheet
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Technical Specifications
NXP Semiconductors MC9S08PA16AVTGR Microcontroller, Microprocessor, FPGA Modules technical specifications.
General
RAM Size
2K x 8
Package / Case
16-TSSOP
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 105°C (TA)
Supply Voltage
2.7V ~ 5.5V
Peripherals
LVD, POR, PWM, WDT
Number of I/O
14
Speed
20MHz
EEPROM Size
256 x 8
Core Processor
S08
Alternate Parts Comparison (MC9S08PA16AVTGR vs MC68HC908QY2CDT vs MC9S08SE8CTG vs MC908QB4CDTE)
Side-by-side technical parameter comparison of related primary models in this product family.
| This Part | Alternate Parts | Alternate Parts | Alternate Parts | |
|---|---|---|---|---|
| Package / Case | 16-TSSOP | 16-TSSOP | 16-TSSOP | 16-TSSOP |
| Mounting Type | Surface Mount | Surface Mount | Surface Mount | Surface Mount |
| Operating Temperature | -40°C ~ 105°C (TA) | -40°C ~ 85°C (TA) | -40°C ~ 85°C (TA) | -40°C ~ 85°C (TA) |
| Supply Voltage | 2.7V ~ 5.5V | 2.7V ~ 5.5V | 2.7V ~ 5.5V | 2.7V ~ 5.5V |
| Core Processor | S08 | HC08 | S08 | HC08 |
| Core Size | 8-Bit | 8-Bit | 8-Bit | 8-Bit |
| RAM Size | 2K x 8 | 128 x 8 | 512 x 8 | 128 x 8 |
| Data Converters | A/D 12x12b | A/D 4x8b | A/D 10x10b | A/D 10x10b |
| Number of I/O | 14 | 13 | 14 | 13 |
| Oscillator Type | Internal | Internal | Internal | Internal |
| Peripherals | LVD, POR, PWM, WDT | LVD, POR, PWM | LVD, POR, PWM | LVD, POR, PWM |
| Program Memory Size | 16KB (16K x 8) | 1.5KB (1.5K x 8) | 8KB (8K x 8) | 4KB (4K x 8) |
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