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NXP Semiconductors NE1619DS,118 Thermal Management

IC TEMP MONITOR 16SSOP

1,741NXP Semiconductors16-SSOP (0.154", 3.90mm Width)RoHS
NE1619DS,118 - No Image Available

Same model may have multiple batches, images only for reference.

NE1619DS,118
Manufacturer
Part Number (MPN)
NE1619DS,118
Detailed Description
IC TEMP MONITOR 16SSOP
Package
16-SSOP (0.154", 3.90mm Width)
Key Features
Package / Case: 16-SSOP (0.154", 3.90mm Width); Mounting Type: Surface Mount
Lifecycle Status
Obsolete
RoHS State
RoHS Compliant
Datasheet
PDF NE1619DS,118 Datasheet
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Technical Specifications

NXP Semiconductors NE1619DS,118 Thermal Management technical specifications.

General

Package / Case
16-SSOP
Mounting Type
Surface Mount
Operating Temperature
0°C ~ 125°C
Supply Voltage
2.8V ~ 5.5V
Output Type
SMBus
Sensor Type
Internal and External
Topology
ADC, Multiplexer, Register Bank
Accuracy
±3°C Local(Max), ±5°C Remote(Max)
Sensing Temperature
0°C ~ 125°C, External Sensor
Output Alarm
Yes

Alternate Parts Comparison (NE1619DS,118 vs NE57810TK/1Y vs NE57810S/N1,518 vs NE57810S,518)

Side-by-side technical parameter comparison of related primary models in this product family.

This PartAlternate PartsAlternate PartsAlternate Parts
Package / Case16-SSOP10-VDFN Exposed PadSPak-5SPak-5
Mounting TypeSurface MountSurface MountSurface MountSurface Mount
Operating Temperature0°C ~ 125°C0°C ~ 70°C (TA)0°C ~ 70°C0°C ~ 70°C
Applications--Converter, DDR SDRAMConverter, DDRConverter, DDR
Input Voltage--1.6V ~ 3.6V1.6V ~ 3.6V1.6V ~ 3.6V
Number of Outputs--111
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