NXP Semiconductors NE1619DS,112 Thermal Management
IC TEMP MONITOR 16SSOP
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
NE1619DS,112
Detailed Description
Package
16-SSOP (0.154", 3.90mm Width)
Key Features
Package / Case: 16-SSOP (0.154", 3.90mm Width); Mounting Type: Surface Mount
Lifecycle Status
Obsolete
RoHS State
Compliant
Datasheet
NE1619DS,112 Datasheet
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Technical Specifications
NXP Semiconductors NE1619DS,112 Thermal Management technical specifications.
General
Operating Temperature
0°C ~ 125°C
Mounting Type
Surface Mount
Package / Case
16-SSOP (0.154", 3.90mm Width)
Output Type
SMBus
Supplier Device Package
16-SSOP
Supply Voltage
2.8V ~ 5.5V
Sensor Type
Internal and External
Topology
ADC, Multiplexer, Register Bank
Accuracy
±3°C Local(Max), ±5°C Remote(Max)
Sensing Temperature
0°C ~ 125°C, External Sensor
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