NXP Semiconductors NE1619DS,112 Thermal Management
IC TEMP MONITOR 16SSOP
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
NE1619DS,112
Detailed Description
IC TEMP MONITOR 16SSOP
Package
16-SSOP (0.154", 3.90mm Width)
Key Features
Package / Case: 16-SSOP (0.154", 3.90mm Width); Mounting Type: Surface Mount
Lifecycle Status
Obsolete
RoHS State
RoHS Compliant
Datasheet
NE1619DS,112 Datasheet
Quick Jump:
Technical Specifications
NXP Semiconductors NE1619DS,112 Thermal Management technical specifications.
General
Package / Case
16-SSOP
Mounting Type
Surface Mount
Operating Temperature
0°C ~ 125°C
Supply Voltage
2.8V ~ 5.5V
Output Type
SMBus
Sensor Type
Internal and External
Topology
ADC, Multiplexer, Register Bank
Accuracy
±3°C Local(Max), ±5°C Remote(Max)
Sensing Temperature
0°C ~ 125°C, External Sensor
Output Alarm
Yes
Alternate Parts Comparison (NE1619DS,112 vs NE57810TK/1Y vs NE57810S/N1,518 vs NE57810S,518)
Side-by-side technical parameter comparison of related primary models in this product family.
| This Part | Alternate Parts | Alternate Parts | Alternate Parts | |
|---|---|---|---|---|
| Package / Case | 16-SSOP | 10-VDFN Exposed Pad | SPak-5 | SPak-5 |
| Mounting Type | Surface Mount | Surface Mount | Surface Mount | Surface Mount |
| Operating Temperature | 0°C ~ 125°C | 0°C ~ 70°C (TA) | 0°C ~ 70°C | 0°C ~ 70°C |
| Applications | -- | Converter, DDR SDRAM | Converter, DDR | Converter, DDR |
| Input Voltage | -- | 1.6V ~ 3.6V | 1.6V ~ 3.6V | 1.6V ~ 3.6V |
| Number of Outputs | -- | 1 | 1 | 1 |
| Action |
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