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NXP Semiconductors MSC8103VT1200F DSP (Digital Signal Processors)

IC DSP 16BIT 300MHZ 332FCBGA

1,035NXP Semiconductors332-BFBGA, FCBGARoHS
MSC8103VT1200F - No Image Available

Same model may have multiple batches, images only for reference.

MSC8103VT1200F
Manufacturer
Part Number (MPN)
MSC8103VT1200F
Detailed Description
IC DSP 16BIT 300MHZ 332FCBGA
Package
332-BFBGA, FCBGA
Key Features
Package / Case: 332-BFBGA, FCBGA; Mounting Type: Surface Mount
Lifecycle Status
Obsolete
RoHS State
RoHS Compliant
Datasheet
PDF MSC8103VT1200F Datasheet
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Technical Specifications

NXP Semiconductors MSC8103VT1200F DSP (Digital Signal Processors) technical specifications.

General

Interface
Communications Processor Module (CPM)
Package / Case
332-BFBGA, FCBGA
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 75°C (TJ)
Type
SC140 Core
Clock Rate
300MHz
Non Volatile Memory
External
On Chip RAM
512KB
Voltage IO
3.30V
Voltage Core
1.60V

Alternate Parts Comparison (MSC8103VT1200F vs MSC8101VT1500F vs MSC8103M1200F vs MSC8101M1375F)

Side-by-side technical parameter comparison of related primary models in this product family.

This PartAlternate PartsAlternate PartsAlternate Parts
Package / Case332-BFBGA, FCBGA332-BFBGA, FCBGA332-BFBGA, FCBGA332-BFBGA, FCBGA
Operating Temperature-40°C ~ 75°C (TJ)-40°C ~ 75°C (TJ)-40°C ~ 75°C (TJ)-40°C ~ 105°C (TJ)
InterfaceCommunications Processor Module (CPM)Communications Processor Module (CPM)Communications Processor Module (CPM)Communications Processor Module (CPM)
Clock Rate300MHz300MHz300MHz275MHz
Non Volatile MemoryExternalExternalExternalExternal
On Chip RAM512KB512KB512KB512KB
TypeSC140 CoreSC140 CoreSC140 CoreSC140 Core
Voltage Core1.60V1.60V1.60V1.60V
Voltage IO3.30V3.30V3.30V3.30V
Mounting TypeSurface Mount--Surface MountSurface Mount
Action

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