NXP Semiconductors MSC8103M1200F DSP (Digital Signal Processors)
DSP 16BIT 300MHZ CPM 332FCBGA
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
MSC8103M1200F
Category
Detailed Description
DSP 16BIT 300MHZ CPM 332FCBGA
Package
332-BFBGA, FCBGA
Key Features
Package / Case: 332-BFBGA, FCBGA; Mounting Type: Surface Mount
Lifecycle Status
Obsolete
RoHS State
RoHS Compliant
Datasheet
MSC8103M1200F Datasheet
Quick Jump:
Technical Specifications
NXP Semiconductors MSC8103M1200F DSP (Digital Signal Processors) technical specifications.
General
Interface
Communications Processor Module (CPM)
Package / Case
332-BFBGA, FCBGA
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 75°C (TJ)
Type
SC140 Core
Clock Rate
300MHz
Non Volatile Memory
External
On Chip RAM
512KB
Voltage IO
3.30V
Voltage Core
1.60V
Alternate Parts Comparison (MSC8103M1200F vs MSC8101VT1500F vs MSC8101M1375F vs MSC8101VT1375F)
Side-by-side technical parameter comparison of related primary models in this product family.
| This Part | Alternate Parts | Alternate Parts | Alternate Parts | |
|---|---|---|---|---|
| Package / Case | 332-BFBGA, FCBGA | 332-BFBGA, FCBGA | 332-BFBGA, FCBGA | 332-BFBGA, FCBGA |
| Operating Temperature | -40°C ~ 75°C (TJ) | -40°C ~ 75°C (TJ) | -40°C ~ 105°C (TJ) | -40°C ~ 105°C (TJ) |
| Interface | Communications Processor Module (CPM) | Communications Processor Module (CPM) | Communications Processor Module (CPM) | Communications Processor Module (CPM) |
| Clock Rate | 300MHz | 300MHz | 275MHz | 275MHz |
| Non Volatile Memory | External | External | External | External |
| On Chip RAM | 512KB | 512KB | 512KB | 512KB |
| Type | SC140 Core | SC140 Core | SC140 Core | SC140 Core |
| Voltage Core | 1.60V | 1.60V | 1.60V | 1.60V |
| Voltage IO | 3.30V | 3.30V | 3.30V | 3.30V |
| Mounting Type | Surface Mount | -- | Surface Mount | Surface Mount |
| Action |
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