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NXP Semiconductors MC33GD3100A3EKR2 Gate Drivers

IGBT GATE DRIVE IC

1,486 ActiveNXP Semiconductors32-BSSOP (0.295", 7.50mm Width)RoHS
MC33GD3100A3EKR2 - No Image Available

Same model may have multiple batches, images only for reference.

MC33GD3100A3EKR2
Manufacturer
Part Number (MPN)
MC33GD3100A3EKR2
Detailed Description
IGBT GATE DRIVE IC
Package
32-BSSOP (0.295", 7.50mm Width)
Key Features
Package / Case: 32-BSSOP (0.295", 7.50mm Width); Mounting Type: Surface Mount
Lifecycle Status
Active
RoHS State
RoHS Compliant
Datasheet
PDF MC33GD3100A3EKR2 Datasheet
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Technical Specifications

NXP Semiconductors MC33GD3100A3EKR2 Gate Drivers technical specifications.

General

Package / Case
32-BSSOP
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 125°C (TA)
Supply Voltage
3.3V
Channel Type
Single
Driven Configuration
Half-Bridge
Number of Drivers
1
Gate Type
IGBT, N-Channel MOSFET
Current Peak Output Source Sink
15A, 15A

Alternate Parts Comparison (MC33GD3100A3EKR2 vs MC705P6ACDWE vs MC711K4CFNE4 vs MC33395TDWBR2)

Side-by-side technical parameter comparison of related primary models in this product family.

This PartAlternate PartsAlternate PartsAlternate Parts
Package / Case32-BSSOP28-SOIC84-LCC32-BSSOP
Mounting TypeSurface MountSurface MountSurface MountSurface Mount
Operating Temperature-40°C ~ 125°C (TA)-40°C ~ 85°C (TA)-40°C ~ 85°C (TA)-40°C ~ 150°C (TJ)
Supply Voltage3.3V5 V4.5V ~ 5.5V5.5V ~ 24V
Channel TypeSingle----3-Phase
Driven ConfigurationHalf-Bridge----Half-Bridge
Gate TypeIGBT, N-Channel MOSFET----N-Channel MOSFET
Number of Drivers1----6
Current Peak Output Source Sink15A, 15A------
Core Processor--HC05HC11--
Core Size--8-Bit8-Bit--
RAM Size--176 B768 x 8--
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