ISSI® IS29GL256-70DLET Flash Memory
IC FLASH 256MBIT PAR 64LFBGA
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
IS29GL256-70DLET
Detailed Description
IC FLASH 256MBIT PAR 64LFBGA
Package
BGA
Lifecycle Status
Active
RoHS State
RoHS Compliant
Datasheet
IS29GL256-70DLET Datasheet
Quick Jump:
Technical Specifications
ISSI® IS29GL256-70DLET Flash Memory technical specifications.
General
Interface
Parallel
Memory Size
256M
RoHS
Compliant
Number of Pins
64
Package / Case
64-LBGA
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 105°C (TA)
Supply Voltage
3/3.3
Lifecycle Status
Active
Automotive
No
Alternate Parts Comparison (IS29GL256-70DLET vs IS22TF64G-JQLA1 vs IS21ES08G-JQLI vs IS25LP512M-RHLE-TR)
Side-by-side technical parameter comparison of related primary models in this product family.
| This Part | Alternate Parts | Alternate Parts | Alternate Parts | |
|---|---|---|---|---|
| Package / Case | 64-LBGA | 100-LBGA | 100-LBGA | 24-TBGA |
| Mounting Type | Surface Mount | Surface Mount | Surface Mount | Surface Mount |
| Operating Temperature | -40°C ~ 105°C (TA) | -40°C ~ 85°C (TA) | -40°C ~ 85°C (TA) | -40°C ~ 105°C (TA) |
| Supply Voltage | 3/3.3 | 3.3 | 3.3 | 2.5/3/3.3 |
| Memory Size | 256M | 512G | 64G | 512M |
| Interface | Parallel | Serial e-MMC | Serial e-MMC | Serial (SPI, Dual SPI, Quad SPI) |
| Number of Pins | 64 | 100 | 100 | 24 |
| RoHS | Compliant | Compliant | Compliant | Compliant |
| Lifecycle Status | Active | Active | Obsolete | Active |
| Architecture | Sectored | Sectored | Sectored | Sectored |
| Automotive | No | Yes | No | No |
| Boot Block | Yes | Yes | Yes | No |
| Action |
More Parts in Flash Memory
Browse additional parts from the same category, grouped by series, package type, and manufacturer. These are catalog suggestions — not verified pin-compatible alternates.
IS25LP256D-RHLE-TRISSI®Package: BGA | Package / Case: 24-TBGA | Mounting Type: Surface Mount | Supply Voltage: 2.5/3/3.3 | Memory Size: 256M | Interface: Serial (SPI, Dual SPI, Quad SPI) | Operating Temperature: -40°C ~ 105°C (TA) | Number of Pins: 24
IS25LP512M-RHLEISSI®Package: BGA | Package / Case: 24-TBGA | Mounting Type: Surface Mount | Supply Voltage: 2.5/3/3.3 | Memory Size: 512M | Interface: Serial (SPI, Dual SPI, Quad SPI) | Operating Temperature: -40°C ~ 105°C (TA) | Number of Pins: 24
IS25LP512M-RHLE-TRISSI®Package: BGA | Package / Case: 24-TBGA | Mounting Type: Surface Mount | Supply Voltage: 2.5/3/3.3 | Memory Size: 512M | Interface: Serial (SPI, Dual SPI, Quad SPI) | Operating Temperature: -40°C ~ 105°C (TA) | Number of Pins: 24
IS29GL256-70DLEBISSI®Package: BGA | Package / Case: 64-LBGA | Mounting Type: Surface Mount | Supply Voltage: 3/3.3 | Memory Size: 256M | Interface: Parallel | Operating Temperature: -40°C ~ 105°C (TA) | Number of Pins: 64