ISSI® IS22ES08G-JCLA1 Flash Memory
IC FLASH 64GBIT EMMC 153VFBGA
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
IS22ES08G-JCLA1
Detailed Description
IC FLASH 64GBIT EMMC 153VFBGA
Package
BGA
Lifecycle Status
NRND
RoHS State
RoHS Compliant
Datasheet
IS22ES08G-JCLA1 Datasheet
Quick Jump:
Technical Specifications
ISSI® IS22ES08G-JCLA1 Flash Memory technical specifications.
General
RoHS
Compliant
Lifecycle Status
NRND
Automotive
Yes
Cell Type
Managed NAND
Memory Size
64G
Architecture
Sectored
Boot Block
Yes
Number of Bits Word Bit
1/4/8
Number of Words
64G/16G/8G
Programmability
Yes
More in This Category
Browse related parts from the same category — sorted by series, manufacturer, and package similarity. These are not verified pin-to-pin substitutes.
IS25LP256D-RHLE-TRISSI®Package: BGA | Package / Case: 24-TBGA | Mounting Type: Surface Mount | Supply Voltage: 2.5/3/3.3 | Memory Size: 256M | Interface: Serial (SPI, Dual SPI, Quad SPI) | Operating Temperature: -40°C ~ 105°C (TA) | Number of Pins: 24
IS25LP512M-RHLEISSI®Package: BGA | Package / Case: 24-TBGA | Mounting Type: Surface Mount | Supply Voltage: 2.5/3/3.3 | Memory Size: 512M | Interface: Serial (SPI, Dual SPI, Quad SPI) | Operating Temperature: -40°C ~ 105°C (TA) | Number of Pins: 24
IS25LP512M-RHLE-TRISSI®Package: BGA | Package / Case: 24-TBGA | Mounting Type: Surface Mount | Supply Voltage: 2.5/3/3.3 | Memory Size: 512M | Interface: Serial (SPI, Dual SPI, Quad SPI) | Operating Temperature: -40°C ~ 105°C (TA) | Number of Pins: 24
IS29GL256-70DLEBISSI®Package: BGA | Package / Case: 64-LBGA | Mounting Type: Surface Mount | Supply Voltage: 3/3.3 | Memory Size: 256M | Interface: Parallel | Operating Temperature: -40°C ~ 105°C (TA) | Number of Pins: 64