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Infineon Technologies CY62167G30-55ZXET Memory Integrated Circuit

IC SRAM 16MBIT PARALLEL 48TSOP I

655 ActiveInfineon Technologies48-TFSOP (0.724", 18.40mm Width)RoHS
CY62167G30-55ZXET - No Image Available

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CY62167G30-55ZXET
Part Number (MPN)
CY62167G30-55ZXET
Detailed Description
IC SRAM 16MBIT PARALLEL 48TSOP I
Package
48-TFSOP (0.724", 18.40mm Width)
Key Features
Package / Case: 48-TFSOP (0.724", 18.40mm Width); Mounting Type: Surface Mount
Lifecycle Status
Active
RoHS State
RoHS Compliant
Datasheet
PDF CY62167G30-55ZXET Datasheet
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Technical Specifications

Infineon Technologies CY62167G30-55ZXET Memory Integrated Circuit technical specifications.

General

Manufacturer
Infineon Technologies
Series
MoBL®
Interface
Parallel
Memory Size
16 Mbit
RoHS
Compliant
Number of Pins
48
Package / Case
48-TFSOP
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 125°C (TA)
Supply Voltage
2.2V ~ 3.6V

Alternate Parts Comparison (CY62167G30-55ZXET vs CY62157H30-55ZSXET vs CY62167DV30LL-70ZI vs CY62157G30-45ZXAT)

Side-by-side technical parameter comparison of related primary models in this product family.

This PartAlternate PartsAlternate PartsAlternate Parts
SeriesMoBL®MoBL®MoBL®MoBL®
Package / Case48-TFSOP48-TFSOP48-TFSOP48-TFSOP
Mounting TypeSurface MountSurface MountSurface MountSurface Mount
Operating Temperature-40°C ~ 125°C (TA)-40°C ~ 125°C (TA)-40°C ~ 85°C (TA)-40°C ~ 85°C (TA)
Supply Voltage2.2V ~ 3.6V2.2V ~ 3.6V2.2V ~ 3.6V2.2V ~ 3.6V
Memory Size16 Mbit8 Mbit16 Mbit8 Mbit
Access Time55 ns55 ns70 ns45 ns
Memory FormatSRAMSRAMSRAMSRAM
Memory InterfaceParallelParallelParallelParallel
Memory Organization2M x 8, 1M x 16512K x 161M x 16, 2M x 8512K x 16
Memory TypeVolatileVolatileVolatileVolatile
TechnologySRAM - AsynchronousSRAM - AsynchronousSRAM - AsynchronousSRAM - Asynchronous
Action

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