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AMD/Xilinx XC6SLX16-2FGG900I FPGAs (Field Programmable Gate Array)

Field Programmable Gate Array (FPGA) with 14,579 logic cells and 18,224 registers, built on 45nm process technology.

In Stock ActiveAMD/XilinxSpartan®-6 LXXC6SLX16FBGARoHS
XC6SLX16-2FGG900I - No Image Available

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XC6SLX16-2FGG900I
Manufacturer
Part Number (MPN)
XC6SLX16-2FGG900I
Base Model
Detailed Description
Field Programmable Gate Array (FPGA) with 14,579 logic cells and 18,224 registers, built on 45nm process technology. Features 576Kbit RAM, 64 (18x18) multipliers, and 32 dedicated DSP blocks. Operates at 1.2V with a transceiver speed of 3.2 Gbps. Housed in a 900-pin Fine Pitch Ball Grid Array (FBGA) package, measuring 31mm x 31mm x 1.75mm, suitable for surface mount applications. Supports a wide operating temperature range from -40°C to 100°C.
Package
FBGA
Key Features
Package: FBGA
Lifecycle Status
Active
RoHS State
RoHS Compliant
Datasheet
PDF XC6SLX16-2FGG900I Datasheet
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Ordering Code Family

XC6SLX16 groups multiple orderable suffixes under one base device. Compare package, grade, and reel options on the base-number page before substituting within the family.

48 ordering variants listed on the family page.

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Technical Specifications

AMD/Xilinx XC6SLX16-2FGG900I FPGAs (Field Programmable Gate Array) technical specifications.

General

RoHS
Yes
Number of Pins
900
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 100°C
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package
FBGA
Package Description
Fine Pitch Ball Grid Array
Lead Shape
Ball
Pcb
900

Alternate Parts Comparison (XC6SLX16-2FGG900I vs XC6SLX16-2CSG225I vs XC6SLX16-2CSG225C vs XC6SLX16-3CSG225C)

Side-by-side technical parameter comparison of related primary models in this product family.

This PartAlternate PartsAlternate PartsAlternate Parts
Mounting TypeSurface MountSurface MountSurface MountSurface Mount
Operating Temperature-40°C ~ 100°C-40°C ~ 100°C (TJ)0°C ~ 85°C0°C ~ 85°C
PackageFBGA225-LFBGA, CSPBGACSBGACSBGA
Number of Pins900--225225
RoHSYes--YesYes
AEC QualifiedNo--NoNo
AutomotiveNo--NoNo
Basic Package TypeBall Grid Array--Ball Grid ArrayBall Grid Array
Cage Code68994--6899468994
Dedicated DSP32--3232
Device Logic Cells14579--1457914579
Device Number of Dlls Plls6--66
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AMD/Xilinx XC6SLX16-2FGG900I FPGAs (Field Programmable Gate Array) Overview

Field Programmable Gate Array (FPGA) with 14,579 logic cells and 18,224 registers, built on 45nm process technology. Features 576Kbit RAM, 64 (18x18) multipliers, and 32 dedicated DSP blocks. Operates at 1.2V with a transceiver speed of 3.2 Gbps. Housed in a 900-pin Fine Pitch Ball Grid Array (FBGA) package, measuring 31mm x 31mm x 1.75mm, suitable for surface mount applications.

Supports a wide operating temperature range from -40°C to 100°C.

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