Skip to main content

AMD/Xilinx XC6SLX16-3FTG256C FPGAs (Field Programmable Gate Array)

Field Programmable Gate Array (FPGA) with 14,579 logic cells and 18,224 registers, built on 45nm process technology.

1,689 ActiveAMD/XilinxSpartan®-6 LXXC6SLX16FTBGA$45.88RoHS
XC6SLX16-3FTG256C - No Image Available

Same model may have multiple batches, images only for reference.

XC6SLX16-3FTG256C
Manufacturer
Part Number (MPN)
XC6SLX16-3FTG256C
Base Model
Detailed Description
Field Programmable Gate Array (FPGA) with 14,579 logic cells and 18,224 registers, built on 45nm process technology. Features 576 Kbit RAM, 64 dedicated 18x18 multipliers, and 32 DSP blocks. Offers 186 user I/Os and a transceiver speed of 3.2 Gbps. Packaged in a 256-pin FTBGA (Fine Pitch Thin Ball Grid Array) with a 17mm x 17mm footprint, suitable for surface mounting. Operates within a temperature range of 0°C to 85°C.
Package
FTBGA
Key Features
Package: FTBGA
Lifecycle Status
Active
RoHS State
RoHS Compliant
Datasheet
PDF XC6SLX16-3FTG256C Datasheet
Quick Jump:
Ready to order?In stock and ready to ship.
Competitive Pricing
Fast & Reliable Delivery
Quality Assured

Ordering Code Family

XC6SLX16 groups multiple orderable suffixes under one base device. Compare package, grade, and reel options on the base-number page before substituting within the family.

48 ordering variants listed on the family page.

View all variants

Technical Specifications

AMD/Xilinx XC6SLX16-3FTG256C FPGAs (Field Programmable Gate Array) technical specifications.

General

RoHS
Yes
Number of Pins
256
Mounting Type
Surface Mount
Operating Temperature
0°C ~ 85°C
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package
FTBGA
Package Description
Fine Pitch Thin Ball Grid Array
Lead Shape
Ball
Pcb
256

Alternate Parts Comparison (XC6SLX16-3FTG256C vs XC6SLX16-2CSG225I vs XC6SLX16-2CPG196I vs XC6SLX16-2CSG225C)

Side-by-side technical parameter comparison of related primary models in this product family.

This PartAlternate PartsAlternate PartsAlternate Parts
Mounting TypeSurface MountSurface MountSurface MountSurface Mount
Operating Temperature0°C ~ 85°C-40°C ~ 100°C (TJ)-40°C ~ 100°C (TJ)0°C ~ 85°C
PackageFTBGA225-LFBGA, CSPBGA196-TFBGA, CSBGACSBGA
Number of Pins256----225
RoHSYes----Yes
AEC QualifiedNo----No
AutomotiveNo----No
Basic Package TypeBall Grid Array----Ball Grid Array
Cage Code68994----68994
Dedicated DSP32----32
Device Logic Cells14579----14579
Device Number of Dlls Plls6----6
Action

AMD/Xilinx XC6SLX16-3FTG256C FPGAs (Field Programmable Gate Array) Overview

Field Programmable Gate Array (FPGA) with 14,579 logic cells and 18,224 registers, built on 45nm process technology. Features 576 Kbit RAM, 64 dedicated 18x18 multipliers, and 32 DSP blocks. Offers 186 user I/Os and a transceiver speed of 3.2 Gbps. Packaged in a 256-pin FTBGA (Fine Pitch Thin Ball Grid Array) with a 17mm x 17mm footprint, suitable for surface mounting.

Operates within a temperature range of 0°C to 85°C.

More Parts in FPGAs (Field Programmable Gate Array)

Browse additional parts from the same category, grouped by series, package type, and manufacturer. These are catalog suggestions — not verified pin-compatible alternates.