AMD/Xilinx XC6SLX16-2FGG676I FPGAs (Field Programmable Gate Array)
Field Programmable Gate Array (FPGA) with 14,579 logic cells and 18,224 registers, built on 45nm process technology.
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
XC6SLX16-2FGG676I
Category
Series
Base Model
Detailed Description
Field Programmable Gate Array (FPGA) with 14,579 logic cells and 18,224 registers, built on 45nm process technology. Features 576 Kbit RAM, 64 18x18 multipliers, and 32 dedicated DSP blocks. Offers 498 maximum user I/Os and 6 DLLs/PLLs. Operates within a -40°C to 100°C temperature range. Packaged in a 676-pin Fine Pitch Ball Grid Array (FBGA) for surface mounting.
Package
FBGA
Key Features
Package: FBGA
Lifecycle Status
Active
RoHS State
RoHS Compliant
Datasheet
XC6SLX16-2FGG676I Datasheet
Quick Jump:
Technical Specifications
AMD/Xilinx XC6SLX16-2FGG676I FPGAs (Field Programmable Gate Array) technical specifications.
General
RoHS
Yes
Number of Pins
676
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 100°C
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package
FBGA
Package Description
Fine Pitch Ball Grid Array
Lead Shape
Ball
Pcb
676
Alternate Parts Comparison (XC6SLX16-2FGG676I vs XC6SLX16-2CSG225I vs XC6SLX16-2CSG225C vs XC6SLX16-3CSG225C)
Side-by-side technical parameter comparison of related primary models in this product family.
| This Part | Alternate Parts | Alternate Parts | Alternate Parts | |
|---|---|---|---|---|
| Mounting Type | Surface Mount | Surface Mount | Surface Mount | Surface Mount |
| Operating Temperature | -40°C ~ 100°C | -40°C ~ 100°C (TJ) | 0°C ~ 85°C | 0°C ~ 85°C |
| Package | FBGA | 225-LFBGA, CSPBGA | CSBGA | CSBGA |
| Number of Pins | 676 | -- | 225 | 225 |
| RoHS | Yes | -- | Yes | Yes |
| AEC Qualified | No | -- | No | No |
| Automotive | No | -- | No | No |
| Basic Package Type | Ball Grid Array | -- | Ball Grid Array | Ball Grid Array |
| Cage Code | 68994 | -- | 68994 | 68994 |
| Dedicated DSP | 32 | -- | 32 | 32 |
| Device Logic Cells | 14579 | -- | 14579 | 14579 |
| Device Number of Dlls Plls | 6 | -- | 6 | 6 |
| Action |
AMD/Xilinx XC6SLX16-2FGG676I FPGAs (Field Programmable Gate Array) Overview
Field Programmable Gate Array (FPGA) with 14,579 logic cells and 18,224 registers, built on 45nm process technology. Features 576 Kbit RAM, 64 18x18 multipliers, and 32 dedicated DSP blocks. Offers 498 maximum user I/Os and 6 DLLs/PLLs. Operates within a -40°C to 100°C temperature range.
Packaged in a 676-pin Fine Pitch Ball Grid Array (FBGA) for surface mounting.
More Parts in FPGAs (Field Programmable Gate Array)
Browse additional parts from the same category, grouped by series, package type, and manufacturer. These are catalog suggestions — not verified pin-compatible alternates.
XC6SLX16-2FT256IAMD/XilinxField Programmable Gate Array (FPGA) with 14,579 logic cells and 18,224 registers, built on 45nm process technology.
XC6SLX16-2FTG256CAMD/XilinxField Programmable Gate Array (FPGA) with 14,579 logic cells and 18,224 registers.
XC6SLX16-2CSG324CAMD/XilinxField Programmable Gate Array (FPGA) with 14,579 logic cells and 18,224 registers, built on 45nm process technology.
XC6SLX16-2CSG225CAMD/XilinxField Programmable Gate Array (FPGA) with 14,579 logic cells and 18,224 registers, built on 45nm process technology.