Winbond Electronics W29N02GZSIBF Flash Memory
2G-BIT 1.8V NAND FLASH MEMORY Automotive AEC-Q100
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
W29N02GZSIBF
Detailed Description
2G-BIT 1.8V NAND FLASH MEMORY Automotive AEC-Q100
Package
TSOP
Key Features
Mounting Type: Surface Mount
Lifecycle Status
Active
RoHS State
RoHS Compliant
Datasheet
W29N02GZSIBF Datasheet
Quick Jump:
Technical Specifications
Winbond Electronics W29N02GZSIBF Flash Memory technical specifications.
General
RoHS
Compliant
Number of Pins
48
Mounting Type
Surface Mount
Lifecycle Status
Active
Automotive
Yes
Package Height
1
Package Width
18.4
Package Length
12
Supplier Package
TSOP
Alternate Parts Comparison (W29N02GZSIBF vs W25Q128JVSIQTR vs W25Q64JVSSIQ-TR vs W25Q64JVSSIQTR)
Side-by-side technical parameter comparison of related primary models in this product family.
| This Part | Alternate Parts | Alternate Parts | Alternate Parts | |
|---|---|---|---|---|
| Mounting Type | Surface Mount | SMD/SMT | SMD/SMT | SMD/SMT |
| Number of Pins | 48 | -- | -- | -- |
| RoHS | Compliant | -- | -- | -- |
| Lifecycle Status | Active | -- | -- | -- |
| Automotive | Yes | -- | -- | -- |
| Package Height | 1 | -- | -- | -- |
| Package Length | 12 | -- | -- | -- |
| Package Width | 18.4 | -- | -- | -- |
| Supplier Package | TSOP | -- | -- | -- |
| Series | -- | W25Q128JV | W25Q64JV | W25Q64JV |
| Package / Case | -- | SOIC-8 | SOIC-8 | SOIC-8 |
| Operating Temperature | -- | - 40°C ~ + 85°C | - 40°C ~ + 85°C | - 40°C ~ + 85°C |
| Action |
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