Winbond Electronics W25Q80BWZPIG Memory ICs
IC FLASH 8MBIT SPI 80MHZ 8WSON
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
W25Q80BWZPIG
Base Model
Detailed Description
IC FLASH 8MBIT SPI 80MHZ 8WSON
Package
8-WDFN Exposed Pad
Lifecycle Status
Obsolete
Datasheet
W25Q80BWZPIG Datasheet
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Technical Specifications
Winbond Electronics W25Q80BWZPIG Memory ICs technical specifications.
General
Manufacturer
Winbond Electronics
Series
SpiFlash®
Memory Size
8Mb (1M x 8)
RoHS
ROHS3 Compliant
Package / Case
8-WDFN Exposed Pad
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 85°C (TA)
Supply Voltage
1.65V ~ 1.95V
Lifecycle Status
Obsolete
Package
8-WDFN Exposed Pad
Alternate Parts Comparison (W25Q80BWZPIG vs W25Q64JVSSIQ-TR vs W25Q64JVSSIQTR vs W25Q64JVSSIQ)
Side-by-side technical parameter comparison of related primary models in this product family.
| This Part | Alternate Parts | Alternate Parts | Alternate Parts | |
|---|---|---|---|---|
| Mounting Type | Surface Mount | SMD/SMT | SMD/SMT | Surface Mount |
| Operating Temperature | -40°C ~ 85°C (TA) | - 40°C ~ + 85°C | - 40°C ~ + 85°C | -40 ~ 85 |
| Supply Voltage | 1.65V ~ 1.95V | 2.7 V ~ 3.6 V | 2.7 V ~ 3.6 V | 3/3.3 |
| Memory Size | 8Mb (1M x 8) | 64 Mbit | 64 Mbit | 64M |
| Series | SpiFlash® | W25Q64JV | W25Q64JV | -- |
| Package / Case | 8-WDFN Exposed Pad | SOIC-8 | SOIC-8 | -- |
| Interface | -- | SPI | SPI | Serial (SPI, Dual SPI, Quad SPI) |
| Timing Type | -- | Synchronous | Synchronous | Synchronous |
| Action |
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