Winbond Electronics W25Q64JVDAIQ Flash Memory
IC FLASH 64MBIT SPI/QUAD 8DIP
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
W25Q64JVDAIQ
Detailed Description
Package
DIP
Key Features
Package: DIP; Package / Case: 8-DIP (0.300", 7.62mm); Mounting Type: Through Hole; Supply Voltage: 3/3.3; Memory Size: 64M; Interface: Serial (SPI, Dual SPI, Quad SPI)
Lifecycle Status
Obsolete
RoHS State
Compliant
Datasheet
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Technical Specifications
Winbond Electronics W25Q64JVDAIQ Flash Memory technical specifications.
General
RoHS
Compliant
ECCN
3A991b.1.a.
Lifecycle Status
Obsolete
HTS
8542.32.00.71
Automotive
No
Ppap
No
Cell Type
NOR
Memory Size
64M
Architecture
Sectored
Boot Block
No
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