Winbond Electronics W25Q32JVXGJQ Flash Memory
IC FLASH 32MBIT SPI/QUAD 8XSON
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
W25Q32JVXGJQ
Detailed Description
Package
8-XSON (4x4)
Key Features
Package: Tube; Package / Case: 8-XDFN Exposed Pad; Mounting Type: Surface Mount; Supply Voltage: 2.7V ~ 3.6V; Memory Size: 32Mbit
Lifecycle Status
Active
RoHS State
Compliant
Datasheet
Quick Jump:
Technical Specifications
Winbond Electronics W25Q32JVXGJQ Flash Memory technical specifications.
General
Max Frequency
133 MHz
Operating Temperature
-40°C ~ 105°C (TA)
Memory Interface
SPI - Quad I/O
ECCN
3A991B1A
Memory Organization
4M x 8
Mounting Type
Surface Mount
Memory Type
Non-Volatile
Lifecycle Status
Active
Supplier Device Package
8-XSON (4x4)
Series
SpiFlash®
More in This Category
Browse related parts from the same category — sorted by series, manufacturer, and package similarity. These are not verified pin-to-pin substitutes.
W25Q64JVXGJQWinbond ElectronicsPackage: Tube | Package / Case: 8-XDFN Exposed Pad | Mounting Type: Surface Mount | Supply Voltage: 2.7V ~ 3.6V | Memory Size: 64Mbit | Operating Temperature: -40°C ~ 105°C (TA)
W25Q32JWXGSQWinbond ElectronicsPackage: Tube | Package / Case: 8-XDFN Exposed Pad | Mounting Type: Surface Mount | Supply Voltage: 1.7V ~ 1.95V | Memory Size: 32Mbit | Operating Temperature: -40°C ~ 125°C (TA)
W25Q64FVXGJQWinbond ElectronicsPackage: Tube | Package / Case: 8-XDFN Exposed Pad | Mounting Type: Surface Mount | Supply Voltage: 2.7V ~ 3.6V | Memory Size: 64Mbit | Operating Temperature: -40°C ~ 105°C (TA)
W25Q64JVXGJMWinbond ElectronicsPackage: Tube | Package / Case: 8-XDFN Exposed Pad | Mounting Type: Surface Mount | Supply Voltage: 2.7V ~ 3.6V | Memory Size: 64Mbit | Operating Temperature: -40°C ~ 105°C (TA)