Winbond Electronics W25Q256JVEIQ Memory ICs
IC FLASH 256MBIT SPI/QUAD 8WSON
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
W25Q256JVEIQ
Base Model
Detailed Description
IC FLASH 256MBIT SPI/QUAD 8WSON
Package
8-WDFN Exposed Pad
Lifecycle Status
Active
Datasheet
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Technical Specifications
Winbond Electronics W25Q256JVEIQ Memory ICs technical specifications.
General
Interface
Serial (SPI, Dual SPI, Quad SPI)
Memory Size
256Mb (32M x 8)
RoHS
Compliant
Number of Pins
8
Package / Case
8-WDFN Exposed Pad
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 85°C (TA)
Supply Voltage
2.7V ~ 3.6V
Lifecycle Status
Active
Package
8-WDFN Exposed Pad
Alternate Parts Comparison (W25Q256JVEIQ vs W25Q64JVSSIQ-TR vs W25Q64JVSSIQTR vs W25Q16FWSNIQ)
Side-by-side technical parameter comparison of related primary models in this product family.
| This Part | Alternate Parts | Alternate Parts | Alternate Parts | |
|---|---|---|---|---|
| Package / Case | 8-WDFN Exposed Pad | SOIC-8 | SOIC-8 | 8-SOIC |
| Mounting Type | Surface Mount | SMD/SMT | SMD/SMT | Surface Mount |
| Operating Temperature | -40°C ~ 85°C (TA) | - 40°C ~ + 85°C | - 40°C ~ + 85°C | -40°C ~ 85°C (TA) |
| Supply Voltage | 2.7V ~ 3.6V | 2.7 V ~ 3.6 V | 2.7 V ~ 3.6 V | 1.65V ~ 1.95V |
| Memory Size | 256Mb (32M x 8) | 64 Mbit | 64 Mbit | 16 Mbit |
| Interface | Serial (SPI, Dual SPI, Quad SPI) | SPI | SPI | -- |
| Timing Type | Synchronous | Synchronous | Synchronous | -- |
| Series | -- | W25Q64JV | W25Q64JV | SpiFlash® |
| Action |
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