Winbond Electronics W25Q16JWBYIQ Flash Memory
IC FLASH 16MBIT SPI/QUAD 8WLCSP

Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
W25Q16JWBYIQ
Detailed Description
Package
8-WLCSP (1.56x2.16)
Key Features
Package: Tube; Package / Case: 8-UFBGA, WLCSP; Mounting Type: Surface Mount; Supply Voltage: 1.65V ~ 1.95V; Memory Size: 16Mbit
Lifecycle Status
Active
RoHS State
Compliant
Datasheet
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Technical Specifications
Winbond Electronics W25Q16JWBYIQ Flash Memory technical specifications.
General
Max Frequency
133 MHz
Operating Temperature
-40°C ~ 85°C (TA)
Memory Interface
SPI - Quad I/O
ECCN
EAR99
Memory Organization
2M x 8
Mounting Type
Surface Mount
Memory Type
Non-Volatile
Lifecycle Status
Active
Supplier Device Package
8-WLCSP (1.56x2.16)
Series
SpiFlash®
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Package: Tube | Package / Case: 8-UFBGA, WLCSP | Mounting Type: Surface Mount | Supply Voltage: 1.65V ~ 1.95V | Memory Size: 16Mbit | Operating Temperature: -40°C ~ 85°C (TA)
Package: Tube | Package / Case: 8-UFBGA, WLCSP | Mounting Type: Surface Mount | Supply Voltage: 1.65V ~ 1.95V | Memory Size: 16Mbit | Operating Temperature: -40°C ~ 85°C (TA)
W25Q16FWSNIQWinbond ElectronicsPackage: Tray | Package / Case: 8-SOIC (0.154", 3.90mm Width) | Mounting Type: Surface Mount | Supply Voltage: 1.65V ~ 1.95V | Memory Size: 16Mbit | Operating Temperature: -40°C ~ 85°C (TA)
W25Q64JVSSIQWinbond ElectronicsPackage: SO | Mounting Type: Surface Mount | Supply Voltage: 3/3.3 | Memory Size: 64M | Interface: Serial (SPI, Dual SPI, Quad SPI) | Number of Pins: 8