Winbond Electronics W25Q01NWZEIQ Memory ICs
SPIFLASH, 1G-BIT, 1.8V, 4KB UNIF
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
W25Q01NWZEIQ
Base Model
Detailed Description
SPIFLASH, 1G-BIT, 1.8V, 4KB UNIF
Package
8-WDFN Exposed Pad
Lifecycle Status
Active
Datasheet
W25Q01NWZEIQ Datasheet
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Technical Specifications
Winbond Electronics W25Q01NWZEIQ Memory ICs technical specifications.
General
Memory Size
1Gb (128M x 8)
RoHS
Compliant
Number of Pins
8
Package / Case
8-WDFN Exposed Pad
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 85°C (TA)
Supply Voltage
1.7V ~ 1.95V
Lifecycle Status
Active
Package
8-WDFN Exposed Pad
Technology
FLASH - NOR
Alternate Parts Comparison (W25Q01NWZEIQ vs W25Q64JVSSIQ-TR vs W25Q64JVSSIQTR vs W25Q80EWSVIG)
Side-by-side technical parameter comparison of related primary models in this product family.
| This Part | Alternate Parts | Alternate Parts | Alternate Parts | |
|---|---|---|---|---|
| Package / Case | 8-WDFN Exposed Pad | SOIC-8 | SOIC-8 | 8-SOIC |
| Mounting Type | Surface Mount | SMD/SMT | SMD/SMT | Surface Mount |
| Operating Temperature | -40°C ~ 85°C (TA) | - 40°C ~ + 85°C | - 40°C ~ + 85°C | -40°C ~ 85°C (TA) |
| Supply Voltage | 1.7V ~ 1.95V | 2.7 V ~ 3.6 V | 2.7 V ~ 3.6 V | 1.65V ~ 1.95V |
| Memory Size | 1Gb (128M x 8) | 64 Mbit | 64 Mbit | 8 Mbit |
| Series | -- | W25Q64JV | W25Q64JV | SpiFlash® |
| Interface | -- | SPI | SPI | SPI |
| Maximum Clock Frequency | -- | 133 MHz | 133 MHz | 104 MHz |
| Data Bus Width | -- | 8 bit | 8 bit | 8 bit |
| Active Read Current Max | -- | 25 mA | 25 mA | 20 mA |
| Moisture Sensitive | -- | Yes | Yes | Yes |
| Organization | -- | 8 M x 8 | 8 M x 8 | 1 M x 8 |
| Action |
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