Texas Instruments TMSDVC5510AGGWA2 DSP (Digital Signal Processors)
IC DSP FIXED POINT BGA
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
TMSDVC5510AGGWA2
Category
Detailed Description
IC DSP FIXED POINT BGA
Package
240-LFBGA
Key Features
Package / Case: 240-LFBGA; Mounting Type: Surface Mount
Lifecycle Status
Obsolete
RoHS State
RoHS Compliant
Datasheet
TMSDVC5510AGGWA2 Datasheet
Quick Jump:
Technical Specifications
Texas Instruments TMSDVC5510AGGWA2 DSP (Digital Signal Processors) technical specifications.
General
Interface
Host Interface, McBSP
Package / Case
240-LFBGA
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 85°C (TC)
Type
Fixed Point
Clock Rate
200MHz
Non Volatile Memory
ROM (32kB)
On Chip RAM
320kB
Voltage IO
3.30V
Voltage Core
1.60V
Alternate Parts Comparison (TMSDVC5510AGGWA2 vs TMSDVC5510AGBCA2 vs TNETV2510ENZGW vs TNETV2505CZGW)
Side-by-side technical parameter comparison of related primary models in this product family.
| This Part | Alternate Parts | Alternate Parts | Alternate Parts | |
|---|---|---|---|---|
| Package / Case | 240-LFBGA | 240-LFBGA | 240-LFBGA | 240-LFBGA |
| Mounting Type | Surface Mount | Surface Mount | Surface Mount | Surface Mount |
| Type | Fixed Point | Fixed Point | Fixed Point | Fixed Point |
| Operating Temperature | -40°C ~ 85°C (TC) | -40°C ~ 85°C (TC) | -- | -- |
| Interface | Host Interface, McBSP | Host Interface, McBSP | -- | -- |
| Clock Rate | 200MHz | 200MHz | -- | -- |
| Non Volatile Memory | ROM (32kB) | ROM (32kB) | -- | -- |
| On Chip RAM | 320kB | 320kB | -- | -- |
| Voltage Core | 1.60V | 1.60V | -- | -- |
| Voltage IO | 3.30V | 3.30V | -- | -- |
| Action |
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