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Texas Instruments TMS320DM335CZCE135 DSPs (Digital Signal Processors)

The TMS320DM335CZCE135 is a 337-pin Ball Grid Array digital signal processor from Texas Instruments.

In Stock ActiveTexas InstrumentsTMS320TMS320DMNFBGARoHS
TMS320DM335CZCE135 - No Image Available

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TMS320DM335CZCE135
Manufacturer
Part Number (MPN)
TMS320DM335CZCE135
Series
Base Model
Detailed Description
The TMS320DM335CZCE135 is a 337-pin Ball Grid Array digital signal processor from Texas Instruments. It features a plastic package with a seated plane height of 1.3mm and a pin pitch of 0.65mm. The processor is designed for surface mount applications and has a package length, width, and height of 13mm, 13mm, and 0.89mm, respectively. The device is suitable for use in a variety of applications, including those with high pin counts and complex digital signal processing requirements.
Package
NFBGA
Key Features
Package: NFBGA
Lifecycle Status
Active
RoHS State
RoHS Compliant
Datasheet
PDF TMS320DM335CZCE135 Datasheet
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Ordering Code Family

TMS320DM groups multiple orderable suffixes under one base device. Compare package, grade, and reel options on the base-number page before substituting within the family.

100 ordering variants listed on the family page.

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Technical Specifications

Texas Instruments TMS320DM335CZCE135 DSPs (Digital Signal Processors) technical specifications.

General

RoHS
Yes
Number of Pins
337
Mounting Type
Surface Mount
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package
NFBGA
Package Description
Plastic Ball Grid Array
Lead Shape
Ball
Pcb
337
Package Length Mm
13

Alternate Parts Comparison (TMS320DM335CZCE135 vs TMS320DM6446BZWT8 vs TMS320DM648CUT7 vs TMS320DM355CZCE216)

Side-by-side technical parameter comparison of related primary models in this product family.

This PartAlternate PartsAlternate PartsAlternate Parts
Mounting TypeSurface Mount------
Number of Pins337------
RoHSYes------
AEC QualifiedNo------
AutomotiveNo------
Basic Package TypeBall Grid Array------
Cage Code01295------
Lead ShapeBall------
PackageNFBGA------
Package DescriptionPlastic Ball Grid Array------
Package Family NameBGA------
Package Height Mm0.89------
Action

Texas Instruments TMS320DM335CZCE135 DSPs (Digital Signal Processors) Overview

The TMS320DM335CZCE135 is a 337-pin Ball Grid Array digital signal processor from Texas Instruments. It features a plastic package with a seated plane height of 1.3mm and a pin pitch of 0.65mm. The processor is designed for surface mount applications and has a package length, width, and height of 13mm, 13mm, and 0.89mm, respectively.

The device is suitable for use in a variety of applications, including those with high pin counts and complex digital signal processing requirements.

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