Texas Instruments LM3S608-EGZ50-C2 Microcontroller, Microprocessor, FPGA Modules
IC MCU 32BIT 32KB FLASH 48VQFN
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
LM3S608-EGZ50-C2
Detailed Description
IC MCU 32BIT 32KB FLASH 48VQFN
Package
48-VFQFN Exposed Pad
Key Features
Package / Case: 48-VFQFN Exposed Pad; Mounting Type: Surface Mount
Lifecycle Status
Obsolete
RoHS State
RoHS Compliant
Datasheet
LM3S608-EGZ50-C2 Datasheet
Quick Jump:
Technical Specifications
Texas Instruments LM3S608-EGZ50-C2 Microcontroller, Microprocessor, FPGA Modules technical specifications.
General
RAM Size
8K x 8
Package / Case
48-VFQFN Exposed Pad
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 105°C (TA)
Supply Voltage
3V ~ 3.6V
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O
28
Speed
50MHz
Core Processor
ARM® Cortex®-M3
Program Memory Type
Flash
Alternate Parts Comparison (LM3S608-EGZ50-C2 vs DAC3152IRGZR vs BQ78PL114RGZR vs TPS53676RSLR)
Side-by-side technical parameter comparison of related primary models in this product family.
| This Part | Alternate Parts | Alternate Parts | Alternate Parts | |
|---|---|---|---|---|
| Package / Case | 48-VFQFN Exposed Pad | 48-VFQFN Exposed Pad | 48-VFQFN Exposed Pad | 48-VFQFN Exposed Pad |
| Mounting Type | Surface Mount | Surface Mount | Surface Mount | Surface Mount |
| Operating Temperature | -40°C ~ 105°C (TA) | -40°C ~ 85°C | -40°C ~ 85°C (TA) | -40°C ~ 125°C (TA) |
| Supply Voltage | 3V ~ 3.6V | -- | -- | 4.5V ~ 17V |
| Core Processor | ARM® Cortex®-M3 | -- | -- | -- |
| Core Size | 32-Bit Single-Core | -- | -- | -- |
| RAM Size | 8K x 8 | -- | -- | -- |
| Connectivity | I²C, Microwire, SPI, SSI, UART/USART | -- | -- | -- |
| Data Converters | A/D 8x10b | -- | -- | -- |
| Number of I/O | 28 | -- | -- | -- |
| Oscillator Type | Internal | -- | -- | -- |
| Peripherals | Brown-out Detect/Reset, POR, PWM, WDT | -- | -- | -- |
| Action |
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