Samsung Semiconductor K9F5608U0C-DIB0 Flash Memory
Flash, 32MX8, 30ns, PBGA63, 9 X 11 MM, 1 MM HEIGHT, 0.80 MM PITCH, TBGA-63
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
K9F5608U0C-DIB0
Detailed Description
Flash, 32MX8, 30ns, PBGA63, 9 X 11 MM, 1 MM HEIGHT, 0.80 MM PITCH, TBGA-63
Lifecycle Status
Active
RoHS State
No
Datasheet
K9F5608U0C-DIB0 Datasheet
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Technical Specifications
Samsung Semiconductor K9F5608U0C-DIB0 Flash Memory technical specifications.
General
RoHS
No
Number of Pins
63
Operating Temperature
-40 ~ 85
Terminal Position
BOTTOM
Jedec Package Code
R-PBGA-B63
Width
9
Length
11
Number of Functions
1
Temperature Grade
INDUSTRIAL
Supply Voltage Nom Vsup
3.3
Alternate Parts Comparison (K9F5608U0C-DIB0 vs K8P6415UQB-PI4B vs KLMAG1JETD-B041 vs K8D3216UBC-PI07)
Side-by-side technical parameter comparison of related primary models in this product family.
| This Part | Alternate Parts | Alternate Parts | Alternate Parts | |
|---|---|---|---|---|
| Operating Temperature | -40 ~ 85 | -40°C ~ 85°C | -25 ~ 85 | -40 ~ 85 |
| RoHS | No | Yes | -- | Yes |
| Memory IC Type | FLASH | -- | FLASH CARD | FLASH |
| Military Spec | False | -- | False | False |
| Number of Words | 33554432 | -- | 17179869184 | 2097152 |
| Number of Words Code | 32000000 | -- | 16000000000 | 2000000 |
| Temperature Grade | INDUSTRIAL | -- | OTHER | INDUSTRIAL |
| Action |
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