Samsung Semiconductor K4S643232F-TC70 DRAM
2M X 32 SDRAM, FOUR BANKS OPERATION, 3.3V POWER SUPPLY
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
K4S643232F-TC70
Detailed Description
Package
TSOP-II
Key Features
Package / Case: TSOP-II; Mounting Type: Surface Mount
Lifecycle Status
Unknown
RoHS State
No
Datasheet
K4S643232F-TC70 Datasheet
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Technical Specifications
Samsung Semiconductor K4S643232F-TC70 DRAM technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
SOP
Package / Case
TSOP-II
Package Description
Thin Small Outline Package (Type II)
Lead Shape
Gull-wing
Number of Pins
86
Pcb
86
Package Length Mm
22.62(Max)
Package Width Mm
10.16
Package Height Mm
1
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