Renesas UPD60510BF1-HN4-M1-A Microcontroller, Microprocessor, FPGA Modules
IC MCU 32BIT ROMLESS 324BGA
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
UPD60510BF1-HN4-M1-A
Detailed Description
IC MCU 32BIT ROMLESS 324BGA
Package
324-BGA
Key Features
Package / Case: 324-BGA; Mounting Type: Surface Mount
Lifecycle Status
Active
RoHS State
RoHS Compliant
Datasheet
UPD60510BF1-HN4-M1-A Datasheet
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Technical Specifications
Renesas UPD60510BF1-HN4-M1-A Microcontroller, Microprocessor, FPGA Modules technical specifications.
General
RAM Size
512K x 8
Package / Case
324-BGA
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 85°C (TA)
Supply Voltage
0.9V ~ 3.6V
Peripherals
DMA, WDT
Number of I/O
96
Speed
100MHz
Core Processor
ARM® Cortex®-M3
Program Memory Type
ROMless
Alternate Parts Comparison (UPD60510BF1-HN4-M1-A vs UPD48576218F1-E24-DW1-E2-A vs UPD48576236F1-E24-DW1-E2-A vs UPD48576218F1-E24-DW1-A)
Side-by-side technical parameter comparison of related primary models in this product family.
| This Part | Alternate Parts | Alternate Parts | Alternate Parts | |
|---|---|---|---|---|
| Package / Case | 324-BGA | 144-TBGA | 144-TBGA | 144-TBGA |
| Mounting Type | Surface Mount | Surface Mount | Surface Mount | Surface Mount |
| Operating Temperature | -40°C ~ 85°C (TA) | 0°C ~ 95°C (TC) | 0°C ~ 95°C (TC) | 0°C ~ 95°C (TC) |
| Supply Voltage | 0.9V ~ 3.6V | 1.7V ~ 1.9V | 1.7V ~ 1.9V | 1.7V ~ 1.9V |
| Memory Size | -- | 576Mb (32M x 18) | 576Mb (16M x 36) | 576Mb (32M x 18) |
| Lifecycle Status | -- | Obsolete | Obsolete | Obsolete |
| Access Time | -- | 20 ns | 20 ns | 20 ns |
| Max Frequency | -- | 400 MHz | 400 MHz | 400 MHz |
| Memory Format | -- | DRAM | DRAM | DRAM |
| Memory Interface | -- | HSTL | HSTL | HSTL |
| Memory Organization | -- | 32M x 18 | 16M x 36 | 32M x 18 |
| Memory Type | -- | Volatile | Volatile | Volatile |
| Action |
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