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NXP Semiconductors XC56309AG100AR2 DSP (Digital Signal Processors)

IC DSP 24BIT 100MHZ 144-LQFP

1,670NXP Semiconductors144-LQFPRoHS
XC56309AG100AR2 - No Image Available

Same model may have multiple batches, images only for reference.

XC56309AG100AR2
Manufacturer
Part Number (MPN)
XC56309AG100AR2
Detailed Description
IC DSP 24BIT 100MHZ 144-LQFP
Package
144-LQFP
Key Features
Package / Case: 144-LQFP; Mounting Type: Surface Mount
Lifecycle Status
Obsolete
RoHS State
RoHS Compliant
Datasheet
PDF XC56309AG100AR2 Datasheet
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Technical Specifications

NXP Semiconductors XC56309AG100AR2 DSP (Digital Signal Processors) technical specifications.

General

Interface
Host Interface, SSI, SCI
Package / Case
144-LQFP
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 105°C (TJ)
Type
Fixed Point
Clock Rate
100MHz
Non Volatile Memory
ROM (576B)
On Chip RAM
24kB
Voltage IO
3.30V
Voltage Core
3.30V

Alternate Parts Comparison (XC56309AG100AR2 vs XC705B32CFNE vs XC56309AG100A vs DSPB56724AG)

Side-by-side technical parameter comparison of related primary models in this product family.

This PartAlternate PartsAlternate PartsAlternate Parts
Package / Case144-LQFP52-LCC144-LQFP144-LQFP
Mounting TypeSurface MountSurface MountSurface MountSurface Mount
Operating Temperature-40°C ~ 105°C (TJ)-40°C ~ 85°C (TA)-40°C ~ 105°C (TJ)0°C ~ 70°C (TA)
InterfaceHost Interface, SSI, SCI--Host Interface, SSI, SCIHost Interface, I²C, SAI, SPI
Clock Rate100MHz--100MHz250MHz
Non Volatile MemoryROM (576B)--ROM (576B)External
On Chip RAM24kB--24kB112kB
TypeFixed Point--Fixed PointAudio Processor
Voltage Core3.30V--3.30V1.20V
Voltage IO3.30V--3.30V3.30V
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