NXP Semiconductors TDF8555J/N2,112 Amplifiers - Audio
IC AMPLIFIER DBS37P
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
TDF8555J/N2,112
Detailed Description
Package
37-SSIP Formed Leads
Key Features
Package / Case: 37-SSIP Formed Leads; Mounting Type: Through Hole
Lifecycle Status
Obsolete
RoHS State
Compliant
Datasheet
TDF8555J/N2,112 Datasheet
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Technical Specifications
NXP Semiconductors TDF8555J/N2,112 Amplifiers - Audio technical specifications.
General
Operating Temperature
-40°C ~ 105°C (TA)
Mounting Type
Through Hole
Package / Case
37-SSIP Formed Leads
Type
Class AB
Output Type
4 Half Bridge
Supplier Device Package
37-PDBS
Supply Voltage
6V ~ 18V
Max Output Power X Channels Load
64W x 1 @ 2Ohm; 45W x 2 @ 4Ohm
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