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NXP Semiconductors SPC5673FF3MVR2 Microcontroller, Microprocessor, FPGA Modules

IC MCU 32BIT 3MB FLASH 416PBGA

2,658 ActiveNXP Semiconductors416-BBGARoHS
SPC5673FF3MVR2 - No Image Available

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SPC5673FF3MVR2
Manufacturer
Part Number (MPN)
SPC5673FF3MVR2
Detailed Description
IC MCU 32BIT 3MB FLASH 416PBGA
Package
416-BBGA
Key Features
Package / Case: 416-BBGA; Mounting Type: Surface Mount
Lifecycle Status
Active
RoHS State
RoHS Compliant
Datasheet
PDF SPC5673FF3MVR2 Datasheet
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Technical Specifications

NXP Semiconductors SPC5673FF3MVR2 Microcontroller, Microprocessor, FPGA Modules technical specifications.

General

RAM Size
192K x 8
Package / Case
416-BBGA
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 125°C (TA)
Supply Voltage
1.08V ~ 5.25V
Peripherals
DMA, POR, PWM
Number of I/O
32
Speed
200MHz
Core Processor
e200z7
Program Memory Type
Flash

Alternate Parts Comparison (SPC5673FF3MVR2 vs SPC5566MVR144R vs SPC5777MK0MVU8R vs SPC5645SF1VVUR)

Side-by-side technical parameter comparison of related primary models in this product family.

This PartAlternate PartsAlternate PartsAlternate Parts
Package / Case416-BBGA416-BBGA416-BBGA416-BBGA
Mounting TypeSurface MountSurface MountSurface MountSurface Mount
Operating Temperature-40°C ~ 125°C (TA)-40°C ~ 125°C (TA)-40°C ~ 125°C (TA)-40°C ~ 105°C (TA)
Supply Voltage1.08V ~ 5.25V1.35V ~ 1.65V3V ~ 5.5V3V ~ 5.5V
Core Processore200z7e200z6e200z7e200z4d
Core Size32-Bit Single-Core32-Bit32-Bit Tri-Core32-Bit Single-Core
RAM Size192K x 8128K x 8404K x 81.064M x 8
ConnectivityCANbus, SCI, SPICANbus, EBI/EMI, Ethernet, SCI, SPICANbus, EBI/EMI, Ethernet, FlexRAY, I²C, LINbus, SPI, PSI, UART/USARTCANbus, I²C, LINbus, SCI, SPI
Data ConvertersA/D 64x12bA/D 40x12bA/D 12b SAR, 16b Sigma-DeltaA/D 20x10b
Oscillator TypeExternalExternalInternalInternal
PeripheralsDMA, POR, PWMDMA, POR, PWM, WDTDMA, LVD, POR, ZipwireDMA, POR, PWM, WDT
Program Memory Size3MB (3M x 8)3MB (3M x 8)8.64MB (8M x 8)2MB (2M x 8)
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