NXP Semiconductors SPC5517EBMLQ66 Microcontroller, Microprocessor, FPGA Modules
IC MCU 32BIT 1.5MB FLASH 144LQFP
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
SPC5517EBMLQ66
Detailed Description
IC MCU 32BIT 1.5MB FLASH 144LQFP
Package
144-LQFP
Key Features
Package / Case: 144-LQFP; Mounting Type: Surface Mount
Lifecycle Status
Active
RoHS State
RoHS Compliant
Datasheet
SPC5517EBMLQ66 Datasheet
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Technical Specifications
NXP Semiconductors SPC5517EBMLQ66 Microcontroller, Microprocessor, FPGA Modules technical specifications.
General
RAM Size
80K x 8
Package / Case
144-LQFP
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 125°C (TA)
Supply Voltage
4.5V ~ 5.25V
Peripherals
DMA, POR, PWM, WDT
Number of I/O
111
Speed
66MHz
Core Processor
e200z0, e200z1
Program Memory Type
Flash
Alternate Parts Comparison (SPC5517EBMLQ66 vs SPC5643LF2MLQ8 vs SPC5633MF2MLQ60R vs MC68EN302AG20BT)
Side-by-side technical parameter comparison of related primary models in this product family.
| This Part | Alternate Parts | Alternate Parts | Alternate Parts | |
|---|---|---|---|---|
| Package / Case | 144-LQFP | 144-LQFP | 144-LQFP | 144-LQFP |
| Operating Temperature | -40°C ~ 125°C (TA) | -40°C ~ 125°C (TA) | -40°C ~ 125°C (TA) | 0°C ~ 70°C (TA) |
| Core Processor | e200z0, e200z1 | e200z4 | e200z3 | M68000 |
| Speed | 66MHz | 80MHz | 60MHz | 20MHz |
| Mounting Type | Surface Mount | Surface Mount | Surface Mount | -- |
| Supply Voltage | 4.5V ~ 5.25V | 3V ~ 5.5V | 4.5V ~ 5.25V | -- |
| Core Size | 32-Bit Dual-Core | 32-Bit Dual-Core | 32-Bit Single-Core | -- |
| RAM Size | 80K x 8 | 128K x 8 | 64K x 8 | -- |
| Connectivity | CANbus, EBI/EMI, I²C, SCI, SPI | CANbus, FlexRay, LINbus, SPI, UART/USART | CANbus, EBI/EMI, LINbus, SCI, SPI, UART/USART | -- |
| Data Converters | A/D 40x12b | A/D 32x12b | A/D 32x12b | -- |
| Oscillator Type | Internal | Internal | Internal | -- |
| Peripherals | DMA, POR, PWM, WDT | DMA, POR, PWM, WDT | DMA, POR, PWM, WDT | -- |
| Action |
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