NXP Semiconductors S9S08DZ60F2CLH Microcontroller, Microprocessor, FPGA Modules
IC MCU 8BIT 60KB FLASH 64LQFP
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
S9S08DZ60F2CLH
Detailed Description
IC MCU 8BIT 60KB FLASH 64LQFP
Package
64-LQFP
Key Features
Package / Case: 64-LQFP; Mounting Type: Surface Mount
Lifecycle Status
Active
RoHS State
RoHS Compliant
Datasheet
S9S08DZ60F2CLH Datasheet
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Technical Specifications
NXP Semiconductors S9S08DZ60F2CLH Microcontroller, Microprocessor, FPGA Modules technical specifications.
General
RAM Size
4K x 8
Package / Case
64-LQFP
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 85°C (TA)
Supply Voltage
2.7V ~ 5.5V
Peripherals
LVD, POR, PWM, WDT
Number of I/O
53
Speed
40MHz
EEPROM Size
2K x 8
Core Processor
S08
Alternate Parts Comparison (S9S08DZ60F2CLH vs S9S12XS256J0VAER vs MCF51JM64EVLHR vs S9S12XS128J1VAE)
Side-by-side technical parameter comparison of related primary models in this product family.
| This Part | Alternate Parts | Alternate Parts | Alternate Parts | |
|---|---|---|---|---|
| Package / Case | 64-LQFP | 64-LQFP | 64-LQFP | 64-LQFP |
| Mounting Type | Surface Mount | Surface Mount | Surface Mount | Surface Mount |
| Operating Temperature | -40°C ~ 85°C (TA) | -40°C ~ 105°C (TA) | -40°C ~ 105°C (TA) | -40°C ~ 105°C (TA) |
| Supply Voltage | 2.7V ~ 5.5V | 1.72V ~ 5.5V | 2.7V ~ 5.5V | 1.72V ~ 5.5V |
| Core Processor | S08 | HCS12X | Coldfire V1 | HCS12X |
| Core Size | 8-Bit | 16-Bit | 32-Bit Single-Core | 16-Bit |
| RAM Size | 4K x 8 | 12K x 8 | 16K x 8 | 8K x 8 |
| Connectivity | CANbus, I²C, LINbus, SCI, SPI | CANbus, SCI, SPI | CANbus, I²C, SCI, SPI, USB OTG | CANbus, SCI, SPI |
| Data Converters | A/D 24x12b | A/D 8x12b | A/D 12x12b | A/D 8x12b |
| Number of I/O | 53 | 44 | 51 | 59 |
| Oscillator Type | External | External | External | External |
| Peripherals | LVD, POR, PWM, WDT | LVD, POR, PWM, WDT | LVD, PWM, WDT | LVD, POR, PWM, WDT |
| Action |
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