NXP Semiconductors S912XD256F1MAAR Microcontroller, Microprocessor, FPGA Modules
IC MCU 16BIT 256KB FLASH 80QFP
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
S912XD256F1MAAR
Detailed Description
IC MCU 16BIT 256KB FLASH 80QFP
Package
80-QFP
Key Features
Package / Case: 80-QFP; Mounting Type: Surface Mount
Lifecycle Status
NRND
RoHS State
RoHS Compliant
Datasheet
S912XD256F1MAAR Datasheet
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Technical Specifications
NXP Semiconductors S912XD256F1MAAR Microcontroller, Microprocessor, FPGA Modules technical specifications.
General
RAM Size
16K x 8
Package / Case
80-QFP
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 125°C (TA)
Supply Voltage
2.35V ~ 5.5V
Peripherals
LVD, POR, PWM, WDT
Number of I/O
59
Speed
80MHz
EEPROM Size
2K x 8
Core Processor
HCS12X
Alternate Parts Comparison (S912XD256F1MAAR vs S912XEQ384BCAA vs S912XDT512J1MAA vs MC711K4CFUE3)
Side-by-side technical parameter comparison of related primary models in this product family.
| This Part | Alternate Parts | Alternate Parts | Alternate Parts | |
|---|---|---|---|---|
| Package / Case | 80-QFP | 80-QFP | 80-QFP | 80-QFP |
| Mounting Type | Surface Mount | Surface Mount | Surface Mount | Surface Mount |
| Operating Temperature | -40°C ~ 125°C (TA) | -40°C ~ 85°C (TA) | -40°C ~ 125°C (TA) | -40°C ~ 85°C (TA) |
| Supply Voltage | 2.35V ~ 5.5V | 1.72V ~ 5.5V | 3.15V ~ 5.5V | 4.5V ~ 5.5V |
| Core Processor | HCS12X | HCS12X | HCS12X | HC11 |
| Core Size | 16-Bit | 16-Bit | 16-Bit | 8-Bit |
| RAM Size | 16K x 8 | 24K x 8 | 20K x 8 | 768 x 8 |
| Connectivity | CANbus, I²C, SCI, SPI | CANbus, EBI/EMI, I²C, IrDA, SCI, SPI | CANbus, I²C, SCI, SPI | SCI, SPI |
| Data Converters | A/D 8x10b, 16x10b | A/D 8x12b | A/D 8x12b | A/D 8x8b |
| EEPROM Size | 2K x 8 | 4K x 8 | 4K x 8 | 640 x 8 |
| Number of I/O | 59 | 59 | 59 | 62 |
| Oscillator Type | Internal | External | External | Internal |
| Action |
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