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NXP Semiconductors P87LPC762BN Microcontroller, Microprocessor, FPGA Modules

P87LPC762 - 80C51, 8-Bit Microco

11,571 ActiveNXP Semiconductors20-DIP (0.300", 7.62mm)RoHS
P87LPC762BN - No Image Available

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P87LPC762BN
Manufacturer
Part Number (MPN)
P87LPC762BN
Detailed Description
P87LPC762 - 80C51, 8-Bit Microco
Package
20-DIP (0.300", 7.62mm)
Key Features
Package / Case: 20-DIP (0.300", 7.62mm); Mounting Type: Through Hole
Lifecycle Status
Active
RoHS State
RoHS Compliant
Datasheet
PDF P87LPC762BN Datasheet
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Technical Specifications

NXP Semiconductors P87LPC762BN Microcontroller, Microprocessor, FPGA Modules technical specifications.

General

Series
LPC700
RAM Size
128 x 8
Package / Case
20-DIP
Mounting Type
Through Hole
Operating Temperature
0°C ~ 70°C (TA)
Supply Voltage
2.7V ~ 6V
Peripherals
Brown-out Detect/Reset, LED, POR, WDT
Number of I/O
18
Speed
20MHz
Core Processor
8051

Alternate Parts Comparison (P87LPC762BN vs MC908KK3ECPE vs MC68HRC908JK1CP vs MC68HC908JK3CP)

Side-by-side technical parameter comparison of related primary models in this product family.

This PartAlternate PartsAlternate PartsAlternate Parts
Package / Case20-DIP20-DIP20-DIP20-DIP
Mounting TypeThrough HoleThrough HoleThrough HoleThrough Hole
Operating Temperature0°C ~ 70°C (TA)-40°C ~ 85°C (TA)-40°C ~ 85°C (TA)-40°C ~ 85°C (TA)
Core Processor8051HC08HC08HC08
Core Size8-Bit8-Bit8-Bit8-Bit
RAM Size128 x 8128 x 8128 x 8128 x 8
Number of I/O18231515
Oscillator TypeInternalInternalExternalExternal
Program Memory Size2KB (2K x 8)4KB (4K x 8)1.5KB (1.5K x 8)4KB (4K x 8)
Program Memory TypeOTPFlashFlashFlash
Speed20MHz8MHz8MHz8MHz
Supply Voltage2.7V ~ 6V--2.7V ~ 3.3V2.7V ~ 3.3V
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