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NXP Semiconductors MR2A16ATS35CR Memory Integrated Circuit

IC RAM 4MBIT PARALLEL 44TSOP II

2,361NXP Semiconductors44-TSOP (0.400", 10.16mm Width)RoHS
MR2A16ATS35CR - No Image Available

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MR2A16ATS35CR
Manufacturer
Part Number (MPN)
MR2A16ATS35CR
Detailed Description
IC RAM 4MBIT PARALLEL 44TSOP II
Package
44-TSOP (0.400", 10.16mm Width)
Key Features
Package / Case: 44-TSOP (0.400", 10.16mm Width); Mounting Type: Surface Mount
Lifecycle Status
Obsolete
RoHS State
RoHS Compliant
Datasheet
PDF MR2A16ATS35CR Datasheet
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Technical Specifications

NXP Semiconductors MR2A16ATS35CR Memory Integrated Circuit technical specifications.

General

Memory Size
4Mb (256K x 16)
Package / Case
44-TSOP
Mounting Type
Surface Mount
Operating Temperature
0°C ~ 70°C (TA)
Supply Voltage
3V ~ 3.6V
Technology
MRAM (Magnetoresistive RAM)
Memory Type
Non-Volatile
Access Time
35 ns
Memory Format
RAM
Memory Interface
Parallel

Alternate Parts Comparison (MR2A16ATS35CR vs MR2A16AYS35R vs MR2A16ATS35C vs FM25V02A-G)

Side-by-side technical parameter comparison of related primary models in this product family.

This PartAlternate PartsAlternate PartsAlternate Parts
Package / Case44-TSOP44-TSOP44-TSOP8-SOIC
Mounting TypeSurface MountSurface MountSurface MountSurface Mount
Operating Temperature0°C ~ 70°C (TA)0°C ~ 70°C (TA)0°C ~ 70°C (TA)-40°C ~ 85°C (TA)
Supply Voltage3V ~ 3.6V3.33V ~ 3.6V3.3
Memory Size4Mb (256K x 16)4M4Mb (256K x 16)256K
Memory FormatRAMRAMRAMFRAM
Memory InterfaceParallelParallelParallelSPI
Memory TypeNon-VolatileNon-VolatileNon-VolatileNon-Volatile
TechnologyMRAM (Magnetoresistive RAM)MRAM (Magnetoresistive RAM)MRAM (Magnetoresistive RAM)FRAM (Ferroelectric RAM)
Access Time35 ns35 ns35 ns--
Write Cycle Time Word Page35ns35ns35ns--
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