NXP Semiconductors MCHC11F1CFNE3R Microcontroller, Microprocessor, FPGA Modules
IC MCU 8BIT ROMLESS 68PLCC
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
MCHC11F1CFNE3R
Detailed Description
IC MCU 8BIT ROMLESS 68PLCC
Package
68-LCC (J-Lead)
Key Features
Package / Case: 68-LCC (J-Lead); Mounting Type: Surface Mount
Lifecycle Status
Last Time Buy
RoHS State
RoHS Compliant
Datasheet
MCHC11F1CFNE3R Datasheet
Quick Jump:
Technical Specifications
NXP Semiconductors MCHC11F1CFNE3R Microcontroller, Microprocessor, FPGA Modules technical specifications.
General
RAM Size
1K x 8
Package / Case
68-LCC
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 85°C (TA)
Supply Voltage
4.75V ~ 5.25V
Peripherals
POR, WDT
Number of I/O
30
Speed
3MHz
EEPROM Size
512 x 8
Core Processor
HC11
Alternate Parts Comparison (MCHC11F1CFNE3R vs MCHC11F1VFNE4 vs MCHC11F1CFNE4R vs MCHC11F1CFNE4)
Side-by-side technical parameter comparison of related primary models in this product family.
| This Part | Alternate Parts | Alternate Parts | Alternate Parts | |
|---|---|---|---|---|
| Package / Case | 68-LCC | 68-LCC | 68-LCC | 68-LCC |
| Mounting Type | Surface Mount | Surface Mount | Surface Mount | Surface Mount |
| Operating Temperature | -40°C ~ 85°C (TA) | -40°C ~ 105°C (TA) | -40°C ~ 85°C (TA) | -40°C ~ 85°C (TA) |
| Supply Voltage | 4.75V ~ 5.25V | 4.75V ~ 5.25V | 4.75V ~ 5.25V | 4.75V ~ 5.25V |
| Core Processor | HC11 | HC11 | HC11 | HC11 |
| Core Size | 8-Bit | 8-Bit | 8-Bit | 8-Bit |
| RAM Size | 1K x 8 | 1K x 8 | 1K x 8 | 1K x 8 |
| Connectivity | SCI, SPI | SCI, SPI | SCI, SPI | SCI, SPI |
| Data Converters | A/D 8x8b | A/D 8x8b | A/D 8x8b | A/D 8x8b |
| EEPROM Size | 512 x 8 | 512 x 8 | 512 x 8 | 512 x 8 |
| Number of I/O | 30 | 30 | 30 | 30 |
| Oscillator Type | Internal | Internal | Internal | Internal |
| Action |
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