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NXP Semiconductors MC9S08QD2MSCR Microcontroller, Microprocessor, FPGA Modules

IC MCU 8BIT 2KB FLASH 8SOIC

41,121 ActiveNXP Semiconductors8-SOIC (0.154", 3.90mm Width)RoHS
MC9S08QD2MSCR - No Image Available

Same model may have multiple batches, images only for reference.

MC9S08QD2MSCR
Manufacturer
Part Number (MPN)
MC9S08QD2MSCR
Detailed Description
IC MCU 8BIT 2KB FLASH 8SOIC
Package
8-SOIC (0.154", 3.90mm Width)
Key Features
Package / Case: 8-SOIC (0.154", 3.90mm Width); Mounting Type: Surface Mount
Lifecycle Status
Active
RoHS State
RoHS Compliant
Datasheet
PDF MC9S08QD2MSCR Datasheet
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Technical Specifications

NXP Semiconductors MC9S08QD2MSCR Microcontroller, Microprocessor, FPGA Modules technical specifications.

General

RAM Size
128 x 8
Package / Case
8-SOIC
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 125°C (TA)
Supply Voltage
2.7V ~ 5.5V
Peripherals
LVD, POR, PWM, WDT
Number of I/O
4
Speed
16MHz
Core Processor
S08
Program Memory Type
Flash

Alternate Parts Comparison (MC9S08QD2MSCR vs MC9RS08KA2CSC vs MC9RS08KA1CSCR vs TJA1050T/CM,118)

Side-by-side technical parameter comparison of related primary models in this product family.

This PartAlternate PartsAlternate PartsAlternate Parts
Package / Case8-SOIC8-SOIC8-SOIC8-SOIC
Mounting TypeSurface MountSurface MountSurface MountSurface Mount
Supply Voltage2.7V ~ 5.5V1.8V ~ 5.5V1.8V ~ 5.5V4.75V ~ 5.25V
Operating Temperature-40°C ~ 125°C (TA)-40°C ~ 85°C (TA)-40°C ~ 85°C (TA)--
Core ProcessorS08RS08RS08--
Core Size8-Bit8-Bit8-Bit--
RAM Size128 x 863 x 863 x 8--
Number of I/O444--
Oscillator TypeInternalInternalInternal--
PeripheralsLVD, POR, PWM, WDTLVD, POR, WDTLVD, POR, WDT--
Program Memory Size2KB (2K x 8)2KB (2K x 8)1KB (1K x 8)--
Program Memory TypeFlashFlashFlash--
Action

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