NXP Semiconductors MC9S08PA4VWJ Microcontroller, Microprocessor, FPGA Modules
IC MCU 8BIT 4KB FLASH 20SOIC
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
MC9S08PA4VWJ
Detailed Description
IC MCU 8BIT 4KB FLASH 20SOIC
Package
20-SOIC (0.295", 7.50mm Width)
Key Features
Package / Case: 20-SOIC (0.295", 7.50mm Width); Mounting Type: Surface Mount
Lifecycle Status
NRND
RoHS State
RoHS Compliant
Datasheet
MC9S08PA4VWJ Datasheet
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Technical Specifications
NXP Semiconductors MC9S08PA4VWJ Microcontroller, Microprocessor, FPGA Modules technical specifications.
General
RAM Size
512 x 8
Package / Case
20-SOIC
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 105°C (TA)
Supply Voltage
2.7V ~ 5.5V
Peripherals
LVD, POR, PWM, WDT
Number of I/O
18
Speed
20MHz
EEPROM Size
128 x 8
Core Processor
S08
Alternate Parts Comparison (MC9S08PA4VWJ vs MC68HRC908JK1CDW vs MC68HRC98JK3ECDW vs MC908JB8JDWE)
Side-by-side technical parameter comparison of related primary models in this product family.
| This Part | Alternate Parts | Alternate Parts | Alternate Parts | |
|---|---|---|---|---|
| Package / Case | 20-SOIC | 20-SOIC | 20-SOIC | 20-SOIC |
| Mounting Type | Surface Mount | Surface Mount | Surface Mount | Surface Mount |
| Operating Temperature | -40°C ~ 105°C (TA) | -40°C ~ 85°C (TA) | -40°C ~ 85°C (TA) | 0°C ~ 70°C (TA) |
| Supply Voltage | 2.7V ~ 5.5V | 2.7V ~ 3.3V | 2.7V ~ 3.3V | 4V ~ 5.5V |
| Core Processor | S08 | HC08 | HC08 | HC08 |
| Core Size | 8-Bit | 8-Bit | 8-Bit | 8-Bit |
| RAM Size | 512 x 8 | 128 x 8 | 128 x 8 | 256 x 8 |
| Number of I/O | 18 | 15 | 15 | 13 |
| Oscillator Type | Internal | External | External | Internal |
| Peripherals | LVD, POR, PWM, WDT | LED, LVD, POR, PWM | LED, LVD, POR, PWM | LVD, POR, PWM |
| Program Memory Size | 4KB (4K x 8) | 1.5KB (1.5K x 8) | 4KB (4K x 8) | 8KB (8K x 8) |
| Program Memory Type | Flash | Flash | Flash | Flash |
| Action |
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