NXP Semiconductors MC9S08PA4VWJ Microcontroller, Microprocessor, FPGA Modules
IC MCU 8BIT 4KB FLASH 20SOIC
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
MC9S08PA4VWJ
Detailed Description
Package
20-SOIC (0.295", 7.50mm Width)
Key Features
Package / Case: 20-SOIC (0.295", 7.50mm Width); Mounting Type: Surface Mount
Lifecycle Status
Not For New Designs
RoHS State
Compliant
Datasheet
MC9S08PA4VWJ Datasheet
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Technical Specifications
NXP Semiconductors MC9S08PA4VWJ Microcontroller, Microprocessor, FPGA Modules technical specifications.
General
Operating Temperature
-40°C ~ 105°C (TA)
Mounting Type
Surface Mount
Package / Case
20-SOIC (0.295", 7.50mm Width)
Supplier Device Package
20-SOIC
Peripherals
LVD, POR, PWM, WDT
Number of I/O
18
Speed
20MHz
EEPROM Size
128 x 8
Core Processor
S08
RAM Size
512 x 8
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