NXP Semiconductors MC68HC705P6AMDW Microcontroller, Microprocessor, FPGA Modules
IC MCU 8BIT 4.5KB OTP 28SOIC
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
MC68HC705P6AMDW
Detailed Description
IC MCU 8BIT 4.5KB OTP 28SOIC
Package
28-SOIC (0.295", 7.50mm Width)
Key Features
Package / Case: 28-SOIC (0.295", 7.50mm Width); Mounting Type: Surface Mount
Lifecycle Status
Obsolete
RoHS State
RoHS Compliant
Datasheet
MC68HC705P6AMDW Datasheet
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Technical Specifications
NXP Semiconductors MC68HC705P6AMDW Microcontroller, Microprocessor, FPGA Modules technical specifications.
General
RAM Size
176 x 8
Package / Case
28-SOIC
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 125°C (TA)
Supply Voltage
3V ~ 5.5V
Peripherals
POR, WDT
Number of I/O
21
Speed
2.1MHz
Core Processor
HC05
Program Memory Type
OTP
Alternate Parts Comparison (MC68HC705P6AMDW vs MC908JB12DWE vs MC908JL3ECDWER vs MC56F8002VWLR)
Side-by-side technical parameter comparison of related primary models in this product family.
| This Part | Alternate Parts | Alternate Parts | Alternate Parts | |
|---|---|---|---|---|
| Package / Case | 28-SOIC | 28-SOIC | 28-SOIC | 28-SOIC |
| Mounting Type | Surface Mount | Surface Mount | Surface Mount | Surface Mount |
| Operating Temperature | -40°C ~ 125°C (TA) | 0°C ~ 70°C (TA) | -40°C ~ 85°C (TA) | -40°C ~ 105°C (TA) |
| Supply Voltage | 3V ~ 5.5V | 4V ~ 5.5V | 2.7V ~ 3.3V | 1.8V ~ 3.6V |
| Core Processor | HC05 | HC08 | HC08 | 56800E |
| Core Size | 8-Bit | 8-Bit | 8-Bit | 16-Bit |
| RAM Size | 176 x 8 | 384 x 8 | 128 x 8 | 1K x 16 |
| Number of I/O | 21 | 21 | 23 | 23 |
| Oscillator Type | Internal | Internal | External | Internal |
| Peripherals | POR, WDT | LED, LVD, POR, PWM | LED, LVD, POR, PWM | LVD, POR, PWM, WDT |
| Program Memory Size | 4.5KB (4.5K x 8) | 12KB (12K x 8) | 4KB (4K x 8) | 12KB (6K x 16) |
| Program Memory Type | OTP | Flash | Flash | Flash |
| Action |
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