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NXP Semiconductors MC33XS2410EL Power Distribution Switches, Load Drivers

HIGH-SIDE SWITCH 60V HTSSOP28

12,872 ActiveNXP Semiconductors28-TSSOP (0.173", 4.40mm Width) Exposed PadRoHS
MC33XS2410EL - No Image Available

Same model may have multiple batches, images only for reference.

MC33XS2410EL
Manufacturer
Part Number (MPN)
MC33XS2410EL
Detailed Description
HIGH-SIDE SWITCH 60V HTSSOP28
Package
28-TSSOP (0.173", 4.40mm Width) Exposed Pad
Key Features
Package / Case: 28-TSSOP (0.173", 4.40mm Width) Exposed Pad; Mounting Type: Surface Mount
Lifecycle Status
Active
RoHS State
RoHS Compliant
Datasheet
PDF MC33XS2410EL Datasheet
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Technical Specifications

NXP Semiconductors MC33XS2410EL Power Distribution Switches, Load Drivers technical specifications.

General

Series
Automotive, AEC-Q100
Interface
SPI
Package / Case
28-TSSOP
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 150°C (TJ)
Supply Voltage
Not Required
Features
Load Discharge, Slew Rate Controlled
Input Type
Non-Inverting
Output Type
N-Channel
Ratio Input Output
1:4

Alternate Parts Comparison (MC33XS2410EL vs MC705P6ACDWE vs MC711K4CFNE4 vs MC9S12D64VPVER)

Side-by-side technical parameter comparison of related primary models in this product family.

This PartAlternate PartsAlternate PartsAlternate Parts
Package / Case28-TSSOP28-SOIC84-LCC112-LQFP
Mounting TypeSurface MountSurface MountSurface MountSurface Mount
Operating Temperature-40°C ~ 150°C (TJ)-40°C ~ 85°C (TA)-40°C ~ 85°C (TA)-40°C ~ 105°C (TA)
Supply VoltageNot Required5 V4.5V ~ 5.5V2.35V ~ 5.25V
SeriesAutomotive, AEC-Q100--HC11HCS12
Core Processor--HC05HC11HCS12
Core Size--8-Bit8-Bit16-Bit
RAM Size--176 B768 x 84K x 8
Connectivity--SIOSCI, SPICANbus, I²C, SCI, SPI
Data Converters--A/D 4x8bA/D 8x8bA/D 8x10b
Number of I/O--216291
Oscillator Type--InternalInternalInternal
Action

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