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NXP Semiconductors MC33FS8405G0ESR2 Power Management - Specialized

SAFETY POWER MANAGEMENT IC, QFN5

14,400 ActiveNXP Semiconductors56-VFQFN Exposed PadRoHS
MC33FS8405G0ESR2 - No Image Available

Same model may have multiple batches, images only for reference.

MC33FS8405G0ESR2
Manufacturer
Part Number (MPN)
MC33FS8405G0ESR2
Detailed Description
SAFETY POWER MANAGEMENT IC, QFN5
Package
56-VFQFN Exposed Pad
Key Features
Package / Case: 56-VFQFN Exposed Pad; Mounting Type: Surface Mount, Wettable Flank
Lifecycle Status
Active
RoHS State
RoHS Compliant
Datasheet
PDF MC33FS8405G0ESR2 Datasheet
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Technical Specifications

NXP Semiconductors MC33FS8405G0ESR2 Power Management - Specialized technical specifications.

General

Series
Automotive, AEC-Q100
Package / Case
56-VFQFN Exposed Pad
Mounting Type
Surface Mount, Wettable Flank
Operating Temperature
-40°C ~ 125°C (TA)
Supply Voltage
60V
Application
System Basis Chip
Current Supply
15mA

Alternate Parts Comparison (MC33FS8405G0ESR2 vs MC33PF8200CLESR2 vs MC33PF8100EPESR2 vs MC33PF8100EPES)

Side-by-side technical parameter comparison of related primary models in this product family.

This PartAlternate PartsAlternate PartsAlternate Parts
Package / Case56-VFQFN Exposed Pad56-VFQFN Exposed Pad56-VFQFN Exposed Pad56-VFQFN Exposed Pad
Mounting TypeSurface Mount, Wettable FlankSurface Mount, Wettable FlankSurface Mount, Wettable FlankSurface Mount, Wettable Flank
Operating Temperature-40°C ~ 125°C (TA)-40°C ~ 105°C (TA)-40°C ~ 105°C (TA)-40°C ~ 105°C (TA)
Supply Voltage60V2.5V ~ 5.5V2.5V ~ 5.5V2.7V ~ 5.5V
Applications--High Performance i.MX 8, S32x Processor BasedHigh Performance i.MX 8, S32x Processor BasedHigh Performance i.MX 8, S32x Processor Based
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