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NXP Semiconductors LPC54016JBD100E Microcontroller, Microprocessor, FPGA Modules

IC MCU 32BIT ROMLESS 100LQFP

35,552 ActiveNXP Semiconductors100-LQFPRoHS
LPC54016JBD100E - No Image Available

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LPC54016JBD100E
Manufacturer
Part Number (MPN)
LPC54016JBD100E
Detailed Description
IC MCU 32BIT ROMLESS 100LQFP
Package
100-LQFP
Key Features
Package / Case: 100-LQFP; Mounting Type: Surface Mount
Lifecycle Status
Active
RoHS State
RoHS Compliant
Datasheet
PDF LPC54016JBD100E Datasheet
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Technical Specifications

NXP Semiconductors LPC54016JBD100E Microcontroller, Microprocessor, FPGA Modules technical specifications.

General

RAM Size
360K x 8
Package / Case
100-LQFP
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 105°C (TA)
Supply Voltage
1.71V ~ 3.6V
Peripherals
Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Number of I/O
64
Speed
180MHz
Core Processor
ARM® Cortex®-M4
Program Memory Type
ROMless

Alternate Parts Comparison (LPC54016JBD100E vs S9S12G192F0VLLR vs DSP56857BUE vs S9S12G192F0VLL)

Side-by-side technical parameter comparison of related primary models in this product family.

This PartAlternate PartsAlternate PartsAlternate Parts
Package / Case100-LQFP100-LQFP100-LQFP100-LQFP
Operating Temperature-40°C ~ 105°C (TA)-40°C ~ 105°C (TA)-40°C ~ 85°C (TA)-40°C ~ 105°C (TA)
Supply Voltage1.71V ~ 3.6V3.13V ~ 5.5V1.62V ~ 1.98V3.13V ~ 5.5V
Core ProcessorARM® Cortex®-M412V156800E12V1
Core Size32-Bit Single-Core16-Bit16-Bit16-Bit
RAM Size360K x 811K x 824K x 1611K x 8
ConnectivityCANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SmartCard, SPI, SPIFI, UART/USART, USBCANbus, IrDA, LINbus, SCI, SPISCI, SPI, SSICANbus, IrDA, LINbus, SCI, SPI
Oscillator TypeInternalInternalExternalInternal
PeripheralsBrown-out Detect/Reset, DMA, I²S, POR, PWM, WDTLVD, POR, PWM, WDTDMA, POR, WDTLVD, POR, PWM, WDT
Program Memory TypeROMlessFlashSRAMFlash
Speed180MHz25MHz120MHz25MHz
Mounting TypeSurface Mount--Surface MountSurface Mount
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