NXP Semiconductors LPC1857FET256,551 Microcontroller, Microprocessor, FPGA Modules
IC MCU 32BIT 1MB FLASH 256LBGA
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
LPC1857FET256,551
Detailed Description
Package
256-LBGA
Key Features
Package / Case: 256-LBGA; Mounting Type: Surface Mount
Lifecycle Status
Active
RoHS State
Compliant
Datasheet
LPC1857FET256,551 Datasheet
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Technical Specifications
NXP Semiconductors LPC1857FET256,551 Microcontroller, Microprocessor, FPGA Modules technical specifications.
General
Operating Temperature
-40°C ~ 85°C (TA)
Mounting Type
Surface Mount
Package / Case
256-LBGA
Supplier Device Package
256-LBGA (17x17)
Peripherals
Brown-out Detect/Reset, DMA, I²S, LCD, Motor Control PWM, POR, PWM, WDT
Number of I/O
164
Speed
180MHz
EEPROM Size
16K x 8
Core Processor
ARM® Cortex®-M3
RAM Size
136K x 8
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