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NXP Semiconductors LPC1112FHN24/202J Microcontroller, Microprocessor, FPGA Modules

IC MCU 32BIT 16KB FLASH 24HVQFN

6,821 ActiveNXP Semiconductors24-VFQFN Exposed PadRoHS
LPC1112FHN24/202J - No Image Available

Same model may have multiple batches, images only for reference.

LPC1112FHN24/202J
Manufacturer
Part Number (MPN)
LPC1112FHN24/202J
Detailed Description
IC MCU 32BIT 16KB FLASH 24HVQFN
Package
24-VFQFN Exposed Pad
Key Features
Package / Case: 24-VFQFN Exposed Pad; Mounting Type: Surface Mount
Lifecycle Status
Active
RoHS State
RoHS Compliant
Datasheet
PDF LPC1112FHN24/202J Datasheet
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Technical Specifications

NXP Semiconductors LPC1112FHN24/202J Microcontroller, Microprocessor, FPGA Modules technical specifications.

General

RAM Size
2K x 8
Package / Case
24-VFQFN Exposed Pad
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 85°C (TA)
Supply Voltage
1.8V ~ 3.6V
Peripherals
Brown-out Detect/Reset, POR, WDT
Number of I/O
19
Speed
50MHz
Core Processor
ARM® Cortex®-M0
Program Memory Type
Flash

Alternate Parts Comparison (LPC1112FHN24/202J vs LPC8N04FHI24Z vs LPC1112FHN24/202,1 vs PCA9535BS,118)

Side-by-side technical parameter comparison of related primary models in this product family.

This PartAlternate PartsAlternate PartsAlternate Parts
Package / Case24-VFQFN Exposed Pad24-VFQFN Exposed Pad24-VFQFN Exposed Pad24-VFQFN Exposed Pad
Mounting TypeSurface MountSurface MountSurface MountSurface Mount
Operating Temperature-40°C ~ 85°C (TA)-40°C ~ 85°C (TA)-40°C ~ 85°C (TA)-40°C ~ 85°C
Supply Voltage1.8V ~ 3.6V1.72V ~ 3.6V1.8V ~ 3.6V2.3V ~ 5.5V
Number of I/O19121916
Core ProcessorARM® Cortex®-M0ARM® Cortex®-M0+ARM® Cortex®-M0--
Core Size32-Bit Single-Core32-Bit Single-Core32-Bit Single-Core--
RAM Size2K x 88K x 82K x 8--
ConnectivityI²C, SPI, UART/USARTI²C, SPII²C, SPI, UART/USART--
Oscillator TypeInternalInternalInternal--
PeripheralsBrown-out Detect/Reset, POR, WDTBrown-out Detect/Reset, POR, PWM, WDTBrown-out Detect/Reset, POR, WDT--
Program Memory Size16KB (16K x 8)32KB (32K x 8)16KB (16K x 8)--
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