Micron Technology Inc. MT29F4G08ABBFAH4-IT:F Flash Memory
SLC NAND Flash Parallel 1.8V 4G-bit 512M x 8 63-Pin VFBGA Tray
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
MT29F4G08ABBFAH4-IT:F
Detailed Description
Package
VFBGA
Key Features
Package: BGA; Package / Case: VFBGA-63; Mounting Type: Surface Mount; Supply Voltage: 1.8; Memory Size: 4G; Interface: Parallel
Lifecycle Status
Active
RoHS State
Compliant
Datasheet
MT29F4G08ABBFAH4-IT:F Datasheet
Quick Jump:
Technical Specifications
Micron Technology Inc. MT29F4G08ABBFAH4-IT:F Flash Memory technical specifications.
General
Fbga Marking Code
NW824
Program Current Ma
25
HTS
8542.32.00.51
ECCN
3A991b.1.a.
Ppap
No
Operating Current Ma
35
Automotive
No
Command Compatible
No
Address Bus Width Bit
30
Min Operating Temp
-40
More in This Category
Browse related parts from the same category — sorted by series, manufacturer, and package similarity. These are not verified pin-to-pin substitutes.
MT29F2G08ABBGAH4-IT:GMicron Technology Inc.Package: BGA | Package / Case: 63-VFBGA | Mounting Type: Surface Mount | Supply Voltage: 1.7V ~ 1.95V | Memory Size: 2G | Interface: Parallel | Operating Temperature: -40°C ~ 85°C (TA) | Number of Pins: 63
MT29F2G08ABBEAH4-IT:EMicron Technology Inc.Package: BGA | Package / Case: 63-VFBGA | Mounting Type: Surface Mount | Supply Voltage: 1.7V ~ 1.95V | Memory Size: 2G | Interface: Parallel | Operating Temperature: -40°C ~ 85°C (TA) | Number of Pins: 63
MT29F4G08ABBDAH4:DMicron Technology Inc.Package: BGA | Package / Case: 63-VFBGA | Mounting Type: Surface Mount | Supply Voltage: 1.7V ~ 1.95V | Memory Size: 4G | Interface: Parallel | Operating Temperature: 0°C ~ 70°C (TA) | Number of Pins: 63
MT29F4G08ABBDAHC-IT:DMicron Technology Inc.Package: BGA | Package / Case: 63-VFBGA | Mounting Type: Surface Mount | Supply Voltage: 1.7V ~ 1.95V | Memory Size: 4G | Interface: Parallel | Operating Temperature: -40°C ~ 85°C (TA) | Number of Pins: 63