Microchip Technology MCP23S08-E/ML O Expanders
IC I/O EXPANDER SPI 8B 20QFN
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
MCP23S08-E/ML
Detailed Description
IC I/O EXPANDER SPI 8B 20QFN
Package
20-VFQFN Exposed Pad
Key Features
Package / Case: 20-VFQFN Exposed Pad; Mounting Type: Surface Mount
Lifecycle Status
Active
RoHS State
RoHS Compliant
Datasheet
MCP23S08-E/ML Datasheet
Quick Jump:
Technical Specifications
Microchip Technology MCP23S08-E/ML O Expanders technical specifications.
General
Interface
SPI
Package / Case
20-VFQFN Exposed Pad
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 125°C
Supply Voltage
1.8V ~ 5.5V
Features
POR
Output Type
Push-Pull
Number of I/O
8
Interrupt Output
Yes
Current Output Source Sink
25mA
Alternate Parts Comparison (MCP23S08-E/ML vs MCP1702T-3302E/CB vs MCP1700T-3002E/TT vs MCP6001T-E/OT)
Side-by-side technical parameter comparison of related primary models in this product family.
| This Part | Alternate Parts | Alternate Parts | Alternate Parts | |
|---|---|---|---|---|
| Mounting Type | Surface Mount | Surface Mount | Surface Mount | Surface Mount |
| Operating Temperature | -40°C ~ 125°C | -40°C ~ 125°C | -40 °C ~ 125 °C | -40°C ~ 125°C |
| Output Type | Push-Pull | Fixed | Fixed | Rail-to-Rail |
| Package / Case | 20-VFQFN Exposed Pad | TO-236-3, SC-59, SOT-23-3 | -- | SC-74A, SOT-753 |
| Supply Voltage | 1.8V ~ 5.5V | -- | 2.3 V ~ 6 V | 5.5 V |
| Number of Pins | -- | 3 | 3 | 5 |
| Number of Channels | -- | 1 | 1 | 1 |
| Lifecycle Status | -- | Production | Production | Production |
| Contact Plating | -- | Tin | Tin | Tin |
| Country of Assembly | -- | Taiwan, Thailand | Thailand | Thailand |
| Country of Fabrication | -- | United States of America | United States of America | United States of America |
| Export Control Classification Number ECCN Code | -- | EAR99 | EAR99 | EAR99 |
| Action |
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