ISSI® IS66WVQ2M4DALL-200BLI SRAM
IC PSRAM 8MBIT SPI/QUAD 24TFBGA

Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
IS66WVQ2M4DALL-200BLI
Detailed Description
Package
24-TFBGA (6x8)
Key Features
Package: Tray; Package / Case: 24-TBGA; Mounting Type: Surface Mount; Supply Voltage: 1.7V ~ 1.95V; Memory Size: 8Mbit; Interface: SPI
Lifecycle Status
Active
RoHS State
Compliant
Datasheet
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Technical Specifications
ISSI® IS66WVQ2M4DALL-200BLI SRAM technical specifications.
General
Max Frequency
200 MHz
Operating Temperature
-40°C ~ 85°C (TA)
Memory Interface
SPI - Quad I/O
ECCN
3A991B2A
Memory Organization
2M x 4
Mounting Type
Surface Mount
Memory Type
Volatile
Lifecycle Status
Active
Supplier Device Package
24-TFBGA (6x8)
Write Cycle Time Word Page
40ns
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Package: Tray | Package / Case: 24-TBGA | Mounting Type: Surface Mount | Supply Voltage: 2.7V ~ 3.6V | Memory Size: 8Mbit | Interface: SPI | Operating Temperature: -40°C ~ 85°C (TA) | Organization: 2 M x 4
Package: Tray | Package / Case: 24-TBGA | Mounting Type: Surface Mount | Supply Voltage: 2.7V ~ 3.6V | Memory Size: 256Mbit | Interface: Serial | Operating Temperature: -40°C ~ 85°C (TA)
Package: Tray | Package / Case: 24-TBGA | Mounting Type: Surface Mount | Supply Voltage: 1.7V ~ 1.95V | Memory Size: 16Mbit | Interface: SPI | Operating Temperature: -40°C ~ 85°C (TA) | Organization: 4 M x 4
Package: Tray | Package / Case: 24-TBGA | Mounting Type: Surface Mount | Supply Voltage: 2.7V ~ 3.6V | Memory Size: 16Mbit | Interface: SPI | Operating Temperature: -40°C ~ 85°C (TA) | Organization: 4 M x 4