IBM 25CPC700BB3B66 Memory Controllers
MEMORY CONTROLLER AND PCI BRIDGE

Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
25CPC700BB3B66
Detailed Description
MEMORY CONTROLLER AND PCI BRIDGE
Package
474-BCBGA Exposed Pad
Key Features
Package / Case: 474-BCBGA Exposed Pad; Mounting Type: Surface Mount
Lifecycle Status
Active
Datasheet
25CPC700BB3B66 Datasheet
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Technical Specifications
IBM 25CPC700BB3B66 Memory Controllers technical specifications.
General
Package / Case
474-BCBGA Exposed Pad
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 105°C (TJ)
Supply Voltage
3.135V ~ 3.465V
Controller Type
Dynamic RAM (DRAM)
Supply Source
Rochester Electronics
Alternate Parts Comparison (25CPC700BB3B66 vs AM29C668JC vs CY7C68033-56LFXC vs DS1312S+T&R)
Side-by-side technical parameter comparison of related primary models in this product family.
| This Part | Alternate Parts | Alternate Parts | Alternate Parts | |
|---|---|---|---|---|
| Package / Case | 474-BCBGA Exposed Pad | 68-LCC | 56-VFQFN Exposed Pad | 16-SOIC |
| Mounting Type | Surface Mount | Surface Mount | Surface Mount | Surface Mount |
| Operating Temperature | -40°C ~ 105°C (TJ) | 0°C ~ 70°C (TA) | 0°C ~ 70°C | -40°C ~ 85°C |
| Supply Voltage | 3.135V ~ 3.465V | 4.5V ~ 5.5V | 3V ~ 3.6V | 4.75V ~ 5.5V |
| Controller Type | Dynamic RAM (DRAM) | Dynamic RAM (DRAM) | NAND Flash - USB | Nonvolatile RAM |
| Action |
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