Analog Devices DS1250Y-EMC NV RAM (FRAM, MRAM, nvSRAM)
IC NVSRAM 4MBIT PARALLEL 32EDIP

Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
DS1250Y-EMC
Detailed Description
Package
32-EDIP
Key Features
Package: Bulk; Package / Case: 32-DIP Module (0.600", 15.24mm); Mounting Type: Through Hole; Supply Voltage: 4.5V ~ 5.5V; Memory Size: 4Mbit
Lifecycle Status
Active
RoHS State
Not applicable
Datasheet
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Technical Specifications
Analog Devices DS1250Y-EMC NV RAM (FRAM, MRAM, nvSRAM) technical specifications.
General
Memory Interface
Parallel
ECCN
3A991B2A
Memory Organization
512K x 8
Mounting Type
Through Hole
Memory Type
Non-Volatile
Lifecycle Status
Active
Supplier Device Package
32-EDIP
Memory Size
4Mbit
Package / Case
32-DIP Module (0.600", 15.24mm)
Technology
NVSRAM (Non-Volatile SRAM)
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Package: Tube | Package / Case: 32-DIP Module (0.600", 15.24mm) | Mounting Type: Through Hole | Supply Voltage: 4.75V ~ 5.25V | Memory Size: 1Mbit | Operating Temperature: 0°C ~ 70°C (TA)
Package: Tube | Package / Case: 32-DIP Module (0.600", 15.24mm) | Mounting Type: Through Hole | Supply Voltage: 4.75V ~ 5.25V | Memory Size: 2Mbit | Operating Temperature: 0°C ~ 70°C (TA)
Package: Tube | Package / Case: 32-DIP Module (0.600", 15.24mm) | Mounting Type: Through Hole | Supply Voltage: 4.5V ~ 5.5V | Memory Size: 1Mbit | Operating Temperature: -40°C ~ 85°C (TA)
Package: Tube | Package / Case: 32-DIP Module (0.600", 15.24mm) | Mounting Type: Through Hole | Supply Voltage: 4.5V ~ 5.5V | Memory Size: 2Mbit | Operating Temperature: -40°C ~ 85°C (TA)