Analog Devices ADAU1860BCBZRL CODECs
56-BUMP WAFER LEVEL CHIP SCALE P
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
ADAU1860BCBZRL
Detailed Description
Package
56-UFBGA, WLCSP
Key Features
Package / Case: 56-UFBGA, WLCSP; Mounting Type: Surface Mount
Lifecycle Status
Active
RoHS State
Compliant
Datasheet
ADAU1860BCBZRL Datasheet
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Technical Specifications
Analog Devices ADAU1860BCBZRL CODECs technical specifications.
General
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
56-UFBGA, WLCSP
Type
Audio
Supplier Device Package
56-WLCSP (2.98x2.68)
Resolution Bits
24 b
Data Interface
I²C, I²S, SPI
Voltage Supply Analog
1.7V ~ 1.98V
Voltage Supply Digital
0.85V ~ 1.21V
Number of Ad Cs Da Cs
3 / 1
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